New SMT Equipment: compressive strength (16)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Lite Fast SR-1000

Lite Fast SR-1000

New Equipment |  

Lite Fast SR-1000, a UV Solder Mask, was designed to screen print over conductive traces, landing pads, resistors, fuses and capacitors on Printed Circuit Boards (PCBs) and ceramic substrates. Other applications include metal and various plastics.

MLT/Micro-Lite Technology

Electronics Forum: compressive strength (6)

Re: Printed Circuit Board Material

Electronics Forum | Wed Oct 18 16:41:35 EDT 2000 | Dave F

It's unrealistic to think that two materials with the following disperant properties would have the same reflow profile. From http://www.norplex.com/Carrier.htm Physical Properties / NEMA FR-4 / NEMA CEM-1 Glass transition temperature �C / 130 / 10

X7R woes

Electronics Forum | Tue Jan 03 05:08:50 EST 2006 | Rob

Yes - as they flex less due to their size. I do have the calculations somewhere from my field apps days but it may take some time to find. The problems occuring with the X7R's MU

Industry News: compressive strength (5)

PrJSC «Mukachevsky Plant «Tochprilad», a leader in subcontracting in the Western Ukraine.

Industry News | 2020-05-29 01:57:07.0

We produce transformers and passive electronic components, automotive loudspeakers, height adjusterfor safety belts, cable harnesses for domestic and automotive applications.

PrJSC «Mukachevsky Plant «Tochprilad»

AI Technology, Inc. (AIT) Releases COOL-PAD™ CPR (Conformal Pad) 7154: Second Generation (US Patent 6,496,373).

Industry News | 2014-03-20 14:21:26.0

COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.

AI Technology, Inc. (AIT)

Parts & Supplies: compressive strength (1)

DEK ES14101

DEK ES14101

Parts & Supplies | ESD Control Supplies

10s 10) Tensile strength: 3.6Mpa 11) Fracture elongation: 188% 12) Tear elongation: 20.6KN/m 13) Rebound elasticity: 14% 14) Impact embrittlement temperature: No damage at -25℃ 15) Permanent compression change rate, 70℃*22h, compression 25%: 17

Shenzhen Eles Technology Co., Ltd

Technical Library: compressive strength (42)

Conductive Adhesive Dispensing, Process Considerations

Technical Library | 1999-08-27 09:24:56.0

Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.

Nordson ASYMTEK

Attaching Fiber Optic Modules

Technical Library | 2019-08-01 10:58:32.0

Optical fibers transmit information in the form of pulses of light. The advantages of optical fibers over traditional copper wires include: higher throughput, greater signal distance and speed, smaller cable mass and diameter, greater pull tension limit, and resistance to electromagnetic interference (EMI) and radio frequency interference(RFI). The disadvantages of fiber optics when compared to copper wires include: end-face defects, cleanliness, and the ease of attaching connectors to electronics assemblies (Figure 1).

ACI Technologies, Inc.

Videos: compressive strength (1)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Career Center - Resumes: compressive strength (1)

prduction engineer

Career Center | chennai, India | Production

i also working in smt operator an 6 mounth.so,i am searching better for my working company.my smt knowledge is operating on printer,pick&place and also reflow and wave soldring.i am operate at full function an the smt machine and i know the all smt c

Express Newsletter: compressive strength (68)

Partner Websites: compressive strength (13)

Leca Building Block Product Assembly Application Bulletin

Nordson ASYMTEK | https://www.nordson.com/zh-CN/divisions/adhesive-dispensing-systems/industries/~/media/Files/Nordson/adhesive-dispensing-systems/Industry/Building-Home-Construction/Leca%20Building%20Block%20Manufacturing%20Application%20Bulletin_March%202016.pdf

. Some of the characteristics/properties leca use offers include: • Lower weight • Moisture impermeability • Frost resistance • Fire resistance • Strong compressive strength To improve thermal insulation, polymer materials such as expanded polystyrene

Nordson ASYMTEK

HOSTAMER®

| https://www.clariant.com/de/Solutions/Products/2014/10/30/12/54/HOSTAMER

. These technologies help ensure desired compressive cement strength, promote rheological control, are low- to non-retarding and, hence, contribute to excellent control of thickening time and short


compressive strength searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next