New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Lite Fast SR-1000, a UV Solder Mask, was designed to screen print over conductive traces, landing pads, resistors, fuses and capacitors on Printed Circuit Boards (PCBs) and ceramic substrates. Other applications include metal and various plastics.
Electronics Forum | Wed Oct 18 16:41:35 EDT 2000 | Dave F
It's unrealistic to think that two materials with the following disperant properties would have the same reflow profile. From http://www.norplex.com/Carrier.htm Physical Properties / NEMA FR-4 / NEMA CEM-1 Glass transition temperature �C / 130 / 10
Electronics Forum | Tue Jan 03 05:08:50 EST 2006 | Rob
Yes - as they flex less due to their size. I do have the calculations somewhere from my field apps days but it may take some time to find. The problems occuring with the X7R's MU
Industry News | 2021-12-23 20:23:39.0
For refrigeration products, high efficiency and energy saving are the constant pursuit and breakthrough of technology. In cooling industry, Mitsubishi Electric has been occupying a significant place. With article, we are going to talk about five advantages of refrigeration compressor of Mitsubishi Electric to allow everyone to understand the technologies of Mitsubishi, and how they have made Mitsubishi a big shot in HVAC industry worldwide.
Industry News | 2020-05-29 01:57:07.0
We produce transformers and passive electronic components, automotive loudspeakers, height adjusterfor safety belts, cable harnesses for domestic and automotive applications.
Parts & Supplies | ESD Control Supplies
10s 10) Tensile strength: 3.6Mpa 11) Fracture elongation: 188% 12) Tear elongation: 20.6KN/m 13) Rebound elasticity: 14% 14) Impact embrittlement temperature: No damage at -25℃ 15) Permanent compression change rate, 70℃*22h, compression 25%: 17
Technical Library | 2022-01-05 23:14:20.0
The process of copper recovery from waste printed circuit board has generated large amounts of non-metallic fraction (NMF) residue. In this research, the residue was recycled as a substitute for fine aggregates at 0%, 5%, 10%, 15%, and 20% to produce interlocking concrete blocks. Properties of the interlocking concrete blocks produced in this study, such as density, water absorption, compressive strength, were firstly examined and the selected mixes were further evaluated for the heavy metal leachability.
Technical Library | 2016-01-12 11:03:35.0
With the pitch size of interconnect getting finer and finer, the bonding strength between flexible and rigid (e.g. PCB, ceramic) substrates becomes a serious issue because it is not strong enough to meet the customer’s requirement. Capillary underfill has been used to enhance the bonding strength between flexible and rigid substrates, but the enhancement is very limited, particularly for high temperature application. The bonding strength of underfilled flexible/rigid interconnect is dramatically decreased after being used at 180◦C, and the interconnects are weakened by the internal stress caused by the expansion of underfill at high temperatures. In order to resolve reliability issues of the interconnect between flexible/rigid substrates, solder joint encapsulant was implemented into the thermal compression bonding process, which was used to manufacture the interconnect between flexible/rigid substrates. Compared to the traditional process, the strength of the interconnect was doubled and the reliability was significantly improved in high temperature application.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
355nm 10W /15W High-Precision CCD FPC/PCB UV Laser Cutting Machine With Perfect CAM interface, it supports the mainstream of the drilling and milling file format; man-machine interface is friendly; optical path is sealed, and it also has stable an
Career Center | chennai, India | Production
i also working in smt operator an 6 mounth.so,i am searching better for my working company.my smt knowledge is operating on printer,pick&place and also reflow and wave soldring.i am operate at full function an the smt machine and i know the all smt c
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/xaloy-wear-technology
. Filled resins are chosen for their superior properties, which include increased tensile and compressive strength, chemical resistance, dielectric, and thermal dimensional stability
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. However, the high tensile strength of AuSn20, not to mention its cost, limits its use to smaller die only. The high conductivity of metal is due to the majority contribution of electronic phonons rather than lattice vibrations
