ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
Detailed introduction of 3D spi-6500 solder paste thickness gauge Product function 1. Friendly programming interface 2. Multiple measurement methods 3. The scanning distance is adjustable 4. 3D simulation function of image 5. Independent
Electronics Forum | Thu Jan 31 15:31:00 EST 2013 | rjohnston58
Are the conditions (Bullets) under the IPC Acceptable and Defect sections "ANDs" or "ORs"? In other words, does every condition under a section must be meet to be Acceptable/Defect or meeting any one condition suffices?
SIEMENS CAMERA 00315224-06 XC-75-UP Part Name Siemens Camera Part Number 00315224-06 Part Model XC-75-UP Condition used,in good condition Supply new and used seimens spare parts for smt machine. original new and used unit. in very good c
Detailed Product Description Brand: JUKI Part Name: ZT Servo AMP Part Number: L901E521000 Condition: Original Used Origin: Japan Warranty: 3 Months L901E521000 JUKI FX-1/R ZT SERVO AMP Original Used with good condition Detail information: 1
Technical Library | 2019-05-21 17:31:39.0
In the field of electronics manufacturing, the end use of the product will always dictate the processes, procedures, and methods, not only for building the product, but also for testing, cleaning, and protecting the assembly in order to assure the level of quality required for proper operation. The need to protect an electronic assembly from its end use environment may stem from anyone of a number of hazardous (or potentially hazardous) conditions. Choosing the type of protective material is dependent upon matching that material’s characteristics with the conditions to be overcome. Naturally, the use of a protective (conformal) coating will require some method of verification to ensure the desired level and type of protection is achieved.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | IPC/WHMA-A-620 Trainer (CIT)
The Certified IPC/WHMA-A-620 Trainer (CIT) courses recognize individuals as qualified trainers in the area of cable and wire harness fabrication and installation, and prepares them to deliver Certified IPC/WHMA-A-620 Specialist (CIS) training.
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How to Minimize Humidity Interaction with PCBAs for Robustness
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Tin Whisker - All You Should Know - SMTA Webtorial
Career Center | Tampa, Florida USA | Management,Purchasing
Reptron Manufacturing Services, a large electronics contract manufacturer, is adding a commodity manager. This position can be based at any of our three facilities in Tampa, Florida, Gaylord, Michigan or Hibbing, Minnesota. Commodity Managers devel
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� Exposure to Siemens Pick & Place M/Cs. � Basic knowledge in POP components, 01005 component package. � Exposure in SIX SIGMA TOOLS � WHITE BELT. � Performing DFM for the new products & running products. � Exposure in scre
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