Industry Directory | Manufacturer
ECM's technology focus is electronic circuit fabrication which compliments EMS's circuit assembly product line.
Industry Directory | Manufacturer
Supplier of high quality engineered materials, including conductive and resistive inks, UV curable dielectrics and insulators, adhesives, coatings, transducer inks and potting compounds.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Tue Jun 22 17:14:41 EDT 1999 | Dennis Fall
I am looking to apply 10-15�m of a conductive material that will withstand 280�C. Our product consists of an alumina substrate sputtered with NiCr (2000�) and Copper (2000�) and 15-60 �m of electroplated copper (all metals patterned on the substrae)
Electronics Forum | Wed Jun 23 10:21:25 EDT 1999 | Chrys Shea
| I am looking to apply 10-15�m of a conductive material that will withstand 280�C. Our product consists of an alumina substrate sputtered with NiCr (2000�) and Copper (2000�) and 15-60 �m of electroplated copper (all metals patterned on the substra
Used SMT Equipment | Pick and Place/Feeders
Type and Parameters of Fuji High Speed Mounting Machine AIMEX II Price FUJI Mounting Machine Product Name: AIMEX II Extensible All-In-One Mater Product brand: FUJI Product Model: AIMEX II Product description: Flexible mount platform for stand-al
Used SMT Equipment | Pick and Place/Feeders
Type and Parameters of Fuji High Speed Mounting Machine AIMEX II Price FUJI Mounting Machine Product Name: AIMEX II Extensible All-In-One Mater Product brand: FUJI Product Model: AIMEX II Product description: Flexible mount platform for stand-al
Industry News | 2011-09-21 12:11:34.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high resolution pumps in Booth #133 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2011-06-13 17:25:04.0
GPD Global will demonstrate its award-winning Positive Cavity Displacement (PCD) Dispensing in Booth #6186 in the North Hall at the upcoming SEMICON West, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.
Parts & Supplies | Tape and Reel
SMT Kapton Tape Polymide film tape Specifications: Antistatic Thermally conductive Polyimides for fine line circuitry Cryogenic insulation Corona resistant Pigmented for color Conformable Other films tailored to meet customers needs Param
Parts & Supplies | Pick and Place/Feeders
FUJI NXT SMT FEEDER PARTS Part Name: FEEDER Power line socket connector PART No: K5051H K5051H K5051H-S K5050A Part Name: CHUTE PART No: PM078M2 PM58906 Part Name: PLATE (W8 handle button metal gasket) PART No: PB01644 PB01643 Part Name: RE
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 1999-08-27 09:24:56.0
Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | | | IPC-7711/7721 Trainer (CIT) Recert.
The Certified IPC-7711/7721 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Trainer (CIS) training.
Events Calendar | Mon May 10 00:00:00 EDT 2021 - Mon May 10 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Manual Cleaning of Printed Board Assemblies – Step by Step Guide
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Woburn, Massachusetts USA | Engineering
Candidate will provide technical support to PCB production areas. Responsibilities will include writing process procedures and monitoring process controls. Candidate will conduct materials analysis/testing and participate in new equipment identi
Career Center | Richardson, Texas USA | Engineering
Develop and set-up surface mount processes that include the full range of surface mount components, board materials and process materials. Conduct DFM reviews prior to release to production. Debug machine software programs. Generate process set-up in
Career Center | bangalore, India | Management
• Hands on experience in planning functions i.e. material planning, scheduling, inventory management. • We have a good knowledge of BOM, KANBAN, MIN-MAX order quantity, • We have Good knowledge in ERP Baan System , • Demand adjustment as per cu
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
SMTnet Express, May 4, 2017, Subscribers: 30,444, Companies: 10,591, Users: 23,216 Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry Francois
Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections. Influence of Nanoparticles, Low Melting
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/conductive-adhesive?page=3
: Fluid Types View All Underfill Two-component (2K) Materials Thermal Interface Material (TIM) Solder Paste Conformal Coating Materials Adhesives Conductive Adhesive Encapsulant Epoxy Flux Lubricant Primer Reagent Silicone Glue Silver Epoxy Surface Mount Adhesive (SMA
Imagineering, Inc. | https://www.pcbnet.com/blog/selecting-pcb-materials-for-fabrication/
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