Industry Directory | Equipment Dealer / Broker / Auctions
BAJA Bid was founded to form an auction organization with the primary objective of providing an outstanding experience for both our buyers and sellers.
Industry Directory | Manufacturer
Supplier of high quality engineered materials, including conductive and resistive inks, UV curable dielectrics and insulators, adhesives, coatings, transducer inks and potting compounds.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Electronics Forum | Wed Dec 08 12:48:01 EST 1999 | Chuck C.
Is anyone out there having problems with noise in analog circuits caused by the residue that no-clean solder paste leaves after reflow? If so do you have any suggestions on how to eliminate the problem??
Electronics Forum | Wed Dec 08 14:44:13 EST 1999 | John Thorup
Hi Chuck We make precision analog and hybrib audio processing equipment for the radio and TV broadcast industry. We have not experienced any problems relating to no-clean reflow since the introduction of the process several years ago. It is known t
Used SMT Equipment | Board Cleaners
Speedline Aquastorm 50 Batch Wash Model: Aquastorm 50 Batch Vintage: 8/2015 Power Clean Basket – Big Board Stackable Rack Automatic Chemistry Dosing System Conductivity Probe For Rinse Discharge Resistivity Meter for Final Rinse Power: 480V, 3-Phase,
Used SMT Equipment | Pick and Place/Feeders
Universal Instruments Polaris Machine For Sale Very clean and in Good Condition See attached pictures and information below Polaris Model Number: 7514A Equipment Number: 10076306 Year 2008 Travel: 550 mm x 800mm Repeatability: +/- 0.01
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Parts & Supplies | Pick and Place/Feeders
Empty belt conducting channel complete
Parts & Supplies | Pick and Place/Feeders
Empty belt conducting channel
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
Training Courses | | | IPC-A-610 Trainer (CIT) Recert.
The Certified IPC-A-610 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-A-610 Specialist (CIS) training.
Training Courses | | | IPC/WHMA-A-620 Trainer (CIT) Recert.
The Certified IPC/WHMA-A-620 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Specialist (CIS) training.
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Events Calendar | Tue Sep 15 00:00:00 EDT 2020 - Tue Sep 15 00:00:00 EDT 2020 | ,
Multitasking Makes You Stupid
Career Center | Denver (Metro), Colorado USA | Engineering,Production
Characterization, optimization, and generation of control plan for PCB (SMT and PTH) assembly processes. Monitor defects and improve yields. Conduct design of experiments, collect and analyze data, conduct machine capability studies, automated equipm
Career Center | , North Carolina USA | Engineering,Production
Description: Characterization, optimization, and generation of control plan for SMT processes. Problem solving for SMT placement and soldering issues. Monitor defects and improve yields. Conduct design of experiments, collect and analyze data, conduc
Career Center | Xiamen, China | Sales/Marketing
I can source, procure and conduct quality control on the products manufactured in China. I can help to source factories, consolidate and ship samples, conduct QC on the manufactured product and arrange shipping for final products. My working exprie
Career Center | Buford, Georgia USA | Technical Support
Over 9 years of Assembleon Electronic Manufacturing Equipment training and support. Primary machine experience: FCM I, II, and Multi-Flex, ACM Micro and AX. Dedicated CTT+ Certified Training Professional. Experienced in Instructor-led training an
Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections. Influence of Nanoparticles, Low Melting
SMTnet Express, May 4, 2017, Subscribers: 30,444, Companies: 10,591, Users: 23,216 Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry Francois
ORION Industries | http://orionindustries.com/pdfs/thermal.pdf
. Sil-Pad , Gap Pad, and Q-Pad are registered trademarks of The Bergquist Company. One Orion Park Drive, Ayer, MA 01432 • Phone: 978-772-6000 • Fax: 978-772-0021 • E-mail: info@orionind.com • www.orionindustries.com ORION INDUSTRIES INCORPORATED GAP PADS Material Thickness Range Thermal Conductivity Gap Pad V0 Soft
FKN Systek | http://fknsystek.com/Wire%20Crimp.htm
About Crimping A crimp connection provides an electrical and a mechanical connection . The measure of the quality for an electrical connection is the conductivity
