Electronics Forum | Sun Feb 28 13:51:56 EST 2021 | bengill
We have a unique connector with flat leads, i.e. the leads leave the connector body flat parallel to the pads. The leads are without a heel, they are flush with the connector body. Moreover, one can't solder beneath the connector because the leads ar
Electronics Forum | Mon Mar 01 11:56:51 EST 2010 | pjc
Your IPC-610 workmanship manual will have the answer for you (I don't have the latest at my fingertips). Depends on what class you are building too, 1, 2 or 3 and the application of this connector on the product- which you must determine.
Electronics Forum | Fri Dec 07 09:43:04 EST 2001 | Russ Steiner
I have a mixed technology PCB that has SMT all on bottom, TH parts on both sides (Yes, I realize that's bad. Can't be avoided.) We have designed a 10-up panel, 2 x 5 array. There are 50 leads per bd, 500 per panel. How much time is reasonable to a
Electronics Forum | Thu Apr 05 09:18:14 EDT 2007 | pjc
Please note that pin holes and blow holes are not always defects. The latest IPC 610A Rev D workmanship standard has them as process indicators- depending on Class. I don't have the document handly while writing this. It would be good to look that up
Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc
Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs
Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew
I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag
Electronics Forum | Thu Feb 10 11:40:25 EST 2005 | Carol
Hello All, Can somebody direct me to a facility or school or even a business that can offer an x-ray course for Class 3 electronic circuit board population interpretation, as in BGA ball acceptance, connector solderability fill acceptance etc.? Some
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