Yamaha YS24X Pick and Place Machine Mounting Capability: 54,000CPH Board size: L50xW50mm to L700xW460mm Applicable Components: s 0402 - 45mm × 45mm, Height 15mm or less Weight: Approx. 1,700KG Product description: Yamaha YS24X Pick and Place M
New Equipment | Industrial Automation
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Electronics Forum | Thu May 10 09:57:22 EDT 2001 | zam_bri
Hi Cal/Dave F, Good news today. The problem went away when I received and ran with a brand new component today. But I'm sure with a robust profile, I should be able to compensate oxidations at some degrees, rite? ( taking into consideration the suc
Electronics Forum | Wed Jun 09 17:53:06 EDT 1999 | Tom B.
| I am interested in seeing how some of you quote smt work. Currently we quote off a bom without component packages known then look in data books to find out what type of component they are. This job will be mine soon but i really believe there is a
Industry News | 2009-11-11 13:00:52.0
Manncorp has introduced a pick-and-place system aimed at OEMs who wish to prototype and perform other short-run PCB assembly in-house. Utilizing newly developed cut strip feeders, the 7700-FV provides the high precision and versatility needed for placement of today’s advanced SMDs, including 0402 chip components, CSPs, BGAs, and fine pitch QFPs. Even 0201s can be mounted with optional nozzle and feeder.
Industry News | 2011-06-24 18:52:10.0
Vicor Corporation, recently evaluated DEK’s award-winning Nano-ProTek stencil nano coating and has reported excellent results. On a densely populated board with multiple 0402, 0201, BGA and micro-BGA components, Nano-ProTek helped improve CpK and yield.
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Career Center | nagercoil, India | Maintenance,Production
3.5 year's experience in smt. Am looking for a growth orinted organization .
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, May 21, 2015, Subscribers: 22,770, Members: Companies: 14,358, Users: 38,224 Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting Brent Fischthal, Michael Cieslinski; Panasonic Factory Solutions Company
Technical Considerations For Controlling ESD In Electronics Manufacturing Technical Considerations For Controlling ESD In Electronics Manufacturing As device geometries get smaller and processing speeds grow faster, their ESD sensitivity
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
-3 Via-In-Pad Plated Over (VIPPO) Design Considerations for Enterprise Server and Storage Hardware Matt Kelly, Mark Jeanson, Timothy Younger, Jim Bielick, Theron Lewis, Mitch Ferrill Abstract 30-2 A Nanocopper Based Alternative to
