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Unparalleled throughput and accuracy in an advanced next generation scalable printer platform. The MPM Edison™ stencil printer is ideally suited for the growing Automotive and Smart Device manufacturing markets. The Edison printer i
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Matching Fooprint to Application The Aquastorm 60 in-line cleaning system is ideal for PCB, semiconductor, and industrial cleaning type applications in which the manufacturing volume has outgrown the capability of a batch type cleaner and/or lack th
Electronics Forum | Mon Nov 13 11:31:10 EST 2000 | John Rep
I am having a problem with wetting on some feedthru wires. The problem seems to be contamination on the wires, due to the fact that the problem seems to be wire lot dependent. I have analysed it using SEM and come up with very little. Is there ano
Electronics Forum | Fri Nov 08 18:32:39 EST 2013 | hegemon
Dave is right, though apparently a bit grumpy today. What he's saying is that the ring de-wetting is a bad thing, and should have been called out by your lab. You might consider a lab change in the future. Some information about your processes, an
Industry News | 2012-06-18 14:49:38.0
Reliability and Failure Analysis Seminar: Lessons Learned in Manufacturing. Presented by Universal Instruments Corporation’s Advanced Process Laboratory. Hosted by Textron Defense Systems, 201 Lowell St., Wilmington, MA
Industry News | 2018-05-30 16:32:42.0
ACL introduces two new lint-free wipe materials for critical cleaning to its Contamination Control line for applications which require pristine surfaces and extrinsic contamination removal.
Technical Library | 2016-12-22 16:44:04.0
Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH) of the particulate matter. In wet condition, particulate matter can electrically bridge closely spaced features on printed circuit boards (PCBs), leading to their electrical failure. (...) The objective of this paper is to develop and describe a practical, routine means of measuring the DRH of minute quantities of particulate matter (1 mg or less) found on PCBs.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
HD footage of the Technical Devices Company's Flood Box in operation on a Nu/Clean 800 Series Inline Cleaner
SMTnet Express February 7, 2013, Subscribers: 26168, Members: Companies: 13281, Users: 34286 Effect of Silicone Contamination on Assembly Processes Silicone contamination is known to have a negative impact on assembly processes such as soldering
| https://www.eptac.com/faqs/ask-helena-leo/ask/dip-tinning-conductors-with-low-temperature-insulation-and-solder-pot-contamination
. This is a training process and should be included in your training program. As to whether there may be contamination in the solder pot, the answer is no, as the material is lighter than the solder and will float on the molten solder pot
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_wave-soldering-sot23_topic995.xml
. All this information is important to us. Poor Wetting can be caused by contamination of the solder or improper solder temperature or conveyor belt moving too fast.
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