New SMT Equipment: contamination with immersion gold (12)

IoT electronics of microElectronics Sensor MEMS package,0.1-0.4mm FR4 pcb with immersion gold

IoT electronics of microElectronics Sensor MEMS package,0.1-0.4mm FR4 pcb with immersion gold

New Equipment |  

Horexs (Boluo HongRuiXing Electronic Limited)is thin FR4 PCB factory(0.1-0.4mm FR4 pcb/2L&multilayer), factory is located in huizhou city China,nearby Shenzhen city. Factory area of Horexs is more than 10000 square meters, which invested 30 milli

Horexs (Hubei)Electronic Limited/HongRuiXing

Electronics Forum: contamination with immersion gold (51)

Golden Finger contamination with Solder after reflow

Electronics Forum | Wed Nov 15 07:21:58 EST 2017 | stephendo

You don't clean contaminated gold fingers so much as you replace them. I once had the "cleaning" solution. It totally dissolved the gold fingers so that they could be replaced.

Golden Finger contamination with Solder after reflow

Electronics Forum | Mon Nov 13 13:49:16 EST 2017 | slthomas

Preemptively you can apply Kapton tape to protect the gold fingers during reflow. I think that's what most people do. After the fact, there are services available to clean them up but as it was described in another thread here, it is not in-expensiv

Industry News: contamination with immersion gold (9)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

KYZEN Establishes New Standard with VOC-free Solvent

Industry News | 2016-09-08 13:23:38.0

KYZEN, a global leader in environmentally responsible cleaning technologies, introduces a new line of solvent blends designed for high reliability in a wide spectrum of industrial cleaning applications. With critical focus on meeting increasing regulations and high quality output, KYZEN’s new solvents have affectionately been dubbed “green and clean,” by many in the industry.

KYZEN Corporation

Technical Library: contamination with immersion gold (3)

Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers

Technical Library | 2012-10-11 19:50:09.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper shows the benefits by using a pure palladium Layer in the ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) and ENEP (Electroless Nickel, Electroless P

Atotech

Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive

Technical Library | 2018-07-11 22:46:13.0

For a demanding automotive electronics assembly, a highly thermal fatigue resistant solder alloy is required, which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder alloy is considered as a high reliability solder alloy due to significant improvement in thermal fatigue resistance as compared to a standard Sn-Ag-Cu alloy. The alloy has not only good thermal fatigue properties but it also has superior ductility and tensile strength by appropriate addition of In; however, initial results indicated a sub-par performance in joint reliability when it is soldered on a printed circuit board (PCB) with Electroless Nickel Immersion Gold (ENIG) surface finish. Numerous experiments were performed to find out appropriate alloying element which would help improve the performance on ENIG PCBs. Sn-Ag-Bi-In solder alloys with and without Cu additions were prepared and then tests were carried out to see the performance in a thermal fatigue test and a drop resistance test.to investigate the impact of Cu addition towards the improvement of joint reliability on ENIG finish PCB. Also, the mechanism of such improvement is documented.

Koki Company LTD

Career Center - Resumes: contamination with immersion gold (2)

B.s (Chemical Engineering) with 2 years experience in pcb industry

Career Center | , India | Engineering,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

I am working as lab chemist and also involved in troubleshooting and process control of various processes in pcb industry

Sales Manager

Career Center | Shen Zhen, China | Management,Sales/Marketing

Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe

Express Newsletter: contamination with immersion gold (160)

Partner Websites: contamination with immersion gold (89)

Taiwan Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-taiwan/

* Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold) Immersion Tin Immersion Silver HASL

Imagineering, Inc.

AW Series

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/products/acoustic-inspection-systems/aw-series

Transducer provides non-immersion scanning which minimizes the risk of contamination and false bond indications. - Dual loadports (optional) for larger batch capacity with loadports for 300mm FOUP or FSOB carriers, for 200mm SMIFs and for 100mm to 200mm cassettes are available

ASYMTEK Products | Nordson Electronics Solutions


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