Industry Directory | Manufacturer
Sprint Circuits,a high technology PCB manufacturing company,Since 2001.Our advantages are quick turn,Thick copper(up to 6oz) ,impendace control and high precision from 6layer to 12layer boards.
Industry Directory | Manufacturer
One of the largest manufacturers of interconnect products in the world. The company designs, and manufactures RF/microwave connectors; flat ribbon cable and interconnect systems.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Electronics Forum | Wed Sep 27 08:28:05 EDT 2006 | AR
Hi all All you wave soldering people, have you had any trouble in keeping the copper level of your SAC solder pots under control? How do you combat the gradual rise of copper contents owing to dissolution from through-hole component leads etc.?
Electronics Forum | Wed Sep 27 10:02:24 EDT 2006 | aj
Hi, We are using SACX and have not noticed any rise in copper. I do know that there are Solder Bars available without the Copper to try and bring the level under control. aj...
Used SMT Equipment | Soldering - Reflow
Speedline Omni 7 Reflow Oven Model: Omni 7 Vintage: 2003 Warranty: 30 Days THE OMNIFLO Each OmniFlo model features the same design criteria and the same robust construction. Our central design theme is to minimize the number of parts in the
Used SMT Equipment | In-Circuit Testers
Agilent 16903A Logic Analysis System The Agilent 16903A logic analysis system provides high-performance, system-level debugging of digital designs. Expandability is the key to the system´s long-term value. Customize this system for your specifi
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Parts & Supplies | Assembly Accessories
J90650281B Samsung SM421 Feida Accessories 8MM 12MM 16MM Feida Power Cord J90650279B Samsung CP45 placement machine 8MM 12MM 16MM 24MM Feida small plastic wheel one-way bearing J1301606 Samsung SMT CP40LV 45FVNEO Feida CP8X2mm 8X4MM long tail new F
Parts & Supplies | Board Cleaners
engine accessory ai rubber hose silicone rubber hose combusition engines Specifications high quality custom cnc machining aluminum metal part products Item high quality custom cnc machining aluminum metal part products Material Stainless Steel
Technical Library | 2008-11-20 00:46:10.0
The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy.
Technical Library | 2020-09-02 22:14:36.0
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The printed circuit board (PCB) must support this trend as the central interconnection of the system. There are several options for fine line circuitry. A typical fine line circuit PCB product using copper foil technology, such as the modified semi-additive process (mSAP), uses a thin base copper layer made by pre-etching. The ultrathin copper foil process (SAP with ultrathin copper foil) is facing a technology limit for the miniaturization due to copper roughness and thickness control. The SAP process using sputtered copper is a solution, but the sputtering process is expensive and has issues with via plating. SAP using electroless copper deposition is another solution, but the process involved is challenged to achieve adequate adhesion and insulation between fine-pitch circuitries. A novel catalyst system--liquid metal ink (LMI)--has been developed that avoids these concerns and promotes a very controlled copper thickness over the substrate, targeting next generation high density interconnect (HDI) to wafer-level packaging substrates and enabling 5-micron level feature sizes. This novel catalyst has a unique feature, high density, and atomic-level deposition. Whereas conventional tin-palladium catalyst systems provide sporadic coverage over the substrate surface, the deposited catalyst covers the entire substrate surface. As a result, the catalyst enables improved uniformity of the copper deposition starting from the initial stage while providing higher adhesion and higher insulation resistance compared to the traditional catalysts used in SAP processes. This article discusses this new catalyst process, which both proposes a typical SAP process using the new catalyst and demonstrates the reliability improvements through a comparison between a new SAP PCB process and a conventional SAP PCB process.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Guillotine type V-cut PCB Cutting Machine Product Description 1. For internal strength generates during separation, Minimize it to value under 180uE ,to avoid solder crack or component damage 2. Able to separate edge of V-slot, minimum distance to
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
SMTnet Express, May 12, 2022, Subscribers: 25,588, Companies: 11,569, Users: 27,213 Electronics Manufacturing Technical Articles Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future
SMTnet Express, November 12, 2015, Subscribers: 23,731, Members: Companies: 14,745, Users: 39,326 The Perfect Copper Surface Eric Stafstrom; Technic Inc. , Garo Chehirian; Tech-Etch In order to provide the functionality in today's electronics
| https://www.feedersupplier.com/sale-13119393-smt-printer-parts-p9505-mpm-bearing-aluminum-copper-ring-used-pcb-assembly-line.html
smt printer parts P9505 MPM Bearing aluminum copper ring used PCB assembly line Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| https://www.eptac.com/blog/understanding-bare-board-inspection-an-essential-quality-control-measure
Understanding Bare Board Inspection: An Essential Quality Control Measure Looking for solder training standards, manuals, kits, and more
