New SMT Equipment: conveyor technologies 1/2 meter (2378)

SMT reject conveyor

SMT reject conveyor

New Equipment | Board Handling - Conveyors

SMT reject conveyor from ASCEN allows PCB printed circuit board manufacturers to easilly isolate bad or reject boards from SMT production line,PCB board rejection is based on up-line process input, typically provided by Automated Optical Inspection (

ASCEN Technology

AOI reject conveyor

AOI reject conveyor

New Equipment | Board Handling - Conveyors

AOI reject conveyor from ASCEN allows PCB printed circuit board manufacturers to easilly isolate bad or reject boards from SMT production line,PCB board rejection is based on up-line process input, typically provided by Automated Optical Inspection (

ASCEN Technology

Electronics Forum: conveyor technologies 1/2 meter (4)

wave soldering and solder bridge

Electronics Forum | Mon Dec 17 12:06:58 EST 2007 | pjc

5 Steps to Eliminate Bridges: 1. Establish (wave) Parallelism First and foremost, you must establish board-to-wave parallelism. This is the prerequisite to any wave solder process control. For an understanding of the power of this approach go to ht

Aqueous Cleaning Systems

Electronics Forum | Thu Feb 06 16:48:45 EST 2003 | Mike Konrad

There are many differences between batch-format and inline format aqueous cleaning systems. First, please allow me two make two things clear. 1: I am a manufacturer of both batch and inline aqueous cleaning systems. Because my company manufactu

Used SMT Equipment: conveyor technologies 1/2 meter (34)

Yamaha YV100XGP / Y17942

Yamaha YV100XGP / Y17942

Used SMT Equipment | Pick and Place/Feeders

1. Manufacturing location of yamaha medium-speed placement machine  2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-

Qinyi Electronics Co.,Ltd

Industry News: conveyor technologies 1/2 meter (28)

2-Part Mixing is now Volumetric Dispensing!

Industry News | 2017-06-14 10:46:29.0

GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.

GPD Global

Nordson ASYMTEK's Helios™ SD-960 Series Automated Dispensing System dispenses medium and bulk volume deposits of single- (1K) and two-component (2K) fluids and supports highly abrasive

Industry News | 2018-03-22 21:11:24.0

Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.

Nordson ASYMTEK

Parts & Supplies: conveyor technologies 1/2 meter (126)

Juki JUKI SMT feeder: JUKI CF03HP feeder

Juki JUKI SMT feeder: JUKI CF03HP feeder

Parts & Supplies | Pick and Place/Feeders

OFFER JUKI Feeders: CF8MM(CF03HP, CF05HP, CF081E, CF081P, CN081C), FF12MM, FF16MM, FF24MM, FF32MM, FF44MM, FF56MM, NF8MM, NF12MM, NF16MM, NF24MM, NF32MM, NF44MM, NF56MM feeder JUKI ES000306200 IDLER SPROCKET JUKI ES000306300 SMD310 CONVEYOR CHAI

KingFei SMT Tech

Siemens Siemens nozzle 701/704/725/733/737/738 nozzle

Siemens Siemens nozzle 701/704/725/733/737/738 nozzle

Parts & Supplies | SMT Equipment

You can send inquiry directly to becky(at)hysmt(dot)cn Informations for your reference,if you are interested,pls contact me. NO. P/N Description UNIT MARK 1 00351498-03 Valve Plunger Assy SP12 (plastic) pak SP12AIR VALVE 2 00351500-03 Valve Plung

KingFei SMT Tech

Technical Library: conveyor technologies 1/2 meter (68)

Placement Optimisation in a Lean Manufacturing Environment

Technical Library | 2008-02-20 21:42:52.0

Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines. They also face an increasing amount of high-mix, small-to-mediumvolume production runs. Even OEMs find it hard to predict what products they will be manufacturing in three to five years time, driving the need to invest in highly flexible production tools that will cater to their needs over the lifetime of the equipment. This paper examines methodologies for optimising the process, improving stock control and providing greater traceability using lean manufacturing techniques.

EUROPLACER

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

Videos: conveyor technologies 1/2 meter (36)

ASCEN Technology

SMT reject conveyor

Videos

NG reject conveyor

PCB reject conveyor

ASCEN Technology

AOI PCB conveyor

Videos

NG reject conveyor

AOI reject conveyor

Career Center - Resumes: conveyor technologies 1/2 meter (3)

Equipment Engineer\B Tech (EC)\7.5+ Years Ex

Career Center | Dargaha Road Zameen Pallavaram Chennai, Tamilnadu India | Maintenance,Technical Support

CURRENT JOB: • Responsible for four sub department as Production support, Preventive maintenance activity, Spare parts control and NPI (New product Introduction) under one Equipment department. • Take care of OEE (Overall Equipment Efficiency), MTTR

An outstanding professional

Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development

Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture  with old style board populators and Panasert robots Worked in H

Express Newsletter: conveyor technologies 1/2 meter (953)

Partner Websites: conveyor technologies 1/2 meter (1742)

JUKI FX-1(FX-2) CONVEYOR PCB ASM - 40007374 - QYSMT

| https://www.qy-smt.com/product-item/juki-fx-1fx-2-conveyor-pcb-asm-40007374/

JUKI FX-1(FX-2) CONVEYOR PCB ASM - 40007374 - QYSMT HOME ABOUT US PRODUCT & SERVICE Panasonic JUKI YAMAHA FUJI SAMSUNG SIEMENS HITACHI

1-Meter Inspection/Bypass Conveyor_ID 113029: World Equipment Source

| https://www.wesource.com/conveyor-systems/1-meter-inspection/bypass-conveyor-id-113029/

! Newsletter Email Address: Click here to unsubscribe 1-Meter Inspection/Bypass Conveyor_ID 113029 Home > Conveyor Systems Click to enlarge More images 1-Meter Inspection/Bypass Conveyor_ID 113029 1-Meter Inspection/Bypass Conveyor_ID 113029 1-Meter Inspection/Bypass Conveyor_ID 113029 1-Meter Inspection


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