Industry Directory | Manufacturer of Assembly Equipment / Antistatic / Drilling / Routing / OEM
Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.
Industry Directory | Component Packaging / Component Preparation / Tape and Reel Services / Test Services / Contract Manufacturer
We are a premier TAPE AND REEL service. We have extensive capabilities for your SMT and Through Hole components. Also I.C. PROGRAMMING including flash memory. First articles provided free of charge.
► Exclusive 10MP / 18MP Camera Technology ► Precision Telecentric Compound Lens Design ► Eight Phase Color Lighting System ► 10MP / 18MP SIDE-VIEWER® Camera System ► Extremely Simple Programming and Operation ► Integrated INTELLI-SCAN® L
New Equipment | Rework & Repair Equipment
Standard Flat Reamer/Straight Fork Tip (SH-20A) (8") Description: Straight Flat Reamer Miniature (left) & Standard (right) Tools with the Miniature Straight Flat Reamer: SH-20C, SH-20E Tools with the Standard Straight Flat Reamer: SH-20A
Electronics Forum | Wed Dec 15 05:15:46 EST 1999 | Marlies Hanf
Hi. Can someone explain to me what coplanarity is? There are a few rather irritating and contradictory definitions of that term. When leads are coplanar - what are they then? Are they parallel to each other or not? Thanks, Marlies
Electronics Forum | Fri Dec 17 15:11:34 EST 1999 | Alvin Kevichusa
Let's look at it this way... Imagine a multileaded component sitting on a flat surface. If all the leads touch the flat surface, they are all in the same plane (that of the flat surface) and are coplanar. Coplanarity is desirable because if a lead is
Used SMT Equipment | Pick and Place/Feeders
Samsung Samsung CP45FV-Neo advantages: 1, simple operation, flexible line change: Samsung's CP and SM series Mounter is recognized by the industry's most simple operation of the model, which uses WinXP system, compatible with Gerb files,
Used SMT Equipment | Chipshooters / Chip Mounters
Samsung chip mounter SM-421 Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to □22mm IC part through On-The-Fly reco
Industry News | 2008-03-25 23:53:54.0
Comment from Brian D�Amico, President
Industry News | 2017-10-24 17:22:53.0
Seika Machinery is pleased to announce that IC packages and LEDs can be stored in a dry box at five percent RH or less for indefinite floor life. Five of the McDry storage cabinets offer less than one percent RH, including: DXU-1001, MCU-201, MCU-301, MCU-401 and the DXU-580SF Feeder Storage Cabinet.
Parts & Supplies | Assembly Accessories
SMT MACHINE GENUINE Juki Spare Parts JUKI FX-1 FX-1R YA PULLEY UNIT R 40025298 Specifications: Brand Name JUKI YA PULLEY Part number 40025298 Model Ensure Test in machine confirmation Guarantee 1 month usage for machine JUKI FX-1 FX-1R
Parts & Supplies | Air / Vaccuum
JUKI 40068169 FX-3 SOLENOID VALVE V 3QB119-00-C2AHV-FL386376-3 for Surface Mount Technology Specifications: Brand Name JUKI SOLENOID VALVE V Part number 40068169 Model 3QB119-00-C2AHV-FL386376-3 running stock 100 pcs Guarantee Origin
Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
MIRTEC MV-7 Series In-Line Automated Optical Inspection Machine - AOI MIRTEC USA, MIRTEC, MIRTEC Corp
Training Courses | ONLINE | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Jun 23 23:30:00 EDT 2016 - Thu Jun 23 12:30:00 EDT 2016 | Rolling Meadows, USA
Measuring Solderability Webinar
Events Calendar | Wed Jan 20 00:00:00 EST 2021 - Fri Jan 22 00:00:00 EST 2021 | Tokyo, Japan
NEPCON JAPAN - Electronics R&D and Manufacturing Technology Expo
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
| https://www.eptac.com/faqs/ask-helena-leo/ask/bridging-two-adjacent-pins-on-an-ic
Bridging Two Adjacent Pins on an IC - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| http://www.purbest-tech.com/en/prshow.asp?id=764
/ Lead Reconditioning System LRS-1 Lead Reconditioning System LRS-1 Introduction LRS-1 can recondition component leads side by side
