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Electronics Forum | Thu Feb 20 17:18:24 EST 2003 | davef
Give us infortmation, please. What is [are]: * Height board to board side of the interposer on the low side of uBGA * Height board to board side of the interposer on the high side of uBGA * Alloy of solder balls, no paste was used correct? * Type of
Electronics Forum | Wed Mar 02 05:14:07 EST 2005 | ABHI
Guys, Solder paste height worries all of us as we encounter the non wets after reflow. More so in fine pitch QFP's. The non wets are not always caused by solder paste height. Many other contributors. Even the pad geometry on te board can contribute t
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YOUNG KY8030-2 3D SPI The World's Best-selling Full 3D Solder Paste Inspection Best-in-class measurement accuracy and inspection reliability Solves shadow problems by utilizing 2-way projection Provides accurate inspection data with real-time P
Industry News | 2009-08-31 13:58:22.0
OXFORD, CT — August 2009 — MIRTEC Corp., the AOI market leader in North America, announces that it will display its MV-3L Desktop AOI System, as well as its MV-7xi In-Line AOI System in booth 725 at the upcoming IPC Midwest Conference & Exhibition, scheduled to take place September 23-24, 2009 at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, IL.
Industry News | 2017-04-03 15:02:09.0
MIRTEC today announced they are participating in the upcoming What's New in Electronics Live! event. They will exhibit in booth #8. They will exhibit in booth #327. The show is scheduled for May 9-10 and will take place at the National Exhibition Center in Birmingham, UK.
Parts & Supplies | Soldering Equipment/Fluxes
3D Solder Paste Inspection Machine Features : Easy to use by fully motorize X-Y scan mechanism. Easy to program by Gerber image navigator Easy to repeat the same job by loading the saved program User-friendly color image live view operation Ea
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Panasonic NPM-D3 Modular SMT Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, P
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PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
| https://www.feedersupplier.com/sale-13018909-smt-koh-young-ky8030-3-spi-inspection-machine.html
) Foreign Material Inspection 3D Foreign Material lnspection(optional) Inspection Items Metrology Capability Volume, Area, Height, Offset, Bridging, Shape Deformity, Coplanarity Types of Defects lnsufficier1t/Excessive/Missing Paste, Bridging, Shape Deformity, Paste
| http://www.szhonreal.com/uploadfile/Download/202305231109343783.pdf
. H dimension does not include signal tower. *4 Option except 200V ■Option ■Specification Model Item Component height Component size Placement speed Placement accuracy Feeder inputs Power supply Apparent power Operating air pressure Air consumption Machine dimensions (W×D×H） *3 Mass(approximately
