IONOX® FCR is a solvent blend designed for removing rosin, low solids and water soluble fluxes while being environmentally friendly. Easy to use, FCR is applied as received. A water rinse is required to remove all traces of soils and cleaner residues
Dual Lane Nitrogen SMT Reflow Oven KTR-800D-N Nitrogen soldering process dual Lane conveyor Weight Approx:2760kg Dimension 5520*1680*1530mm Product description: 8 Zones Dual Lane Nitrogen SMT Reflow Oven KTR-800D-N China Manufacturer, Nitrogen
Electronics Forum | Fri Jun 06 18:44:26 EDT 2003 | davef
No, no. It's koscher to have thermal planes. You just need to: * Work with your fabricator to keep the layup balanced. * Relieve the plane so that it doesn't cause assembly problems. While probably not directly for your part, it gives a starting p
Electronics Forum | Sat Jan 30 16:42:32 EST 2016 | davef
Many board fabs help their customer understand the importance of copper balance. Copper balance * http://www.multi-circuit-boards.eu/en/pcb-design-aid/copper-balance.html * http://electronics.stackexchange.com/questions/85633/what-is-copper-thiev
Industry News | 2009-03-02 00:10:24.0
TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.
Technical Library | 2018-02-22 10:56:36.0
As companies start to implement lead free soldering processes, hand soldering and associated techniques have been identified as key functions in the manufacturing process requiring additional research and development. Hand soldering tends to occur at the end of the process line where the circuit board has a high intrinsic value and so correct process control will have a significant affect on manufacturing costs and productivity.This paper discusses the fundamental aspects of the hand soldering process and discusses process adaptation requirements for successful lead free implementation.
Technical Library | 1999-05-09 13:05:12.0
This Technical Note discusses the construction of solder tips, the various failure modes associated with tip plating (cracking, wear, corrosion, and dewetting), how to diagnose those failure modes, and specific practices that can be taken to minimize or eliminate each one.
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
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