New SMT Equipment: copper delamination (5)

IPC-A-600H Standard

IPC-A-600H Standard

New Equipment | Education/Training

IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o

BEST Inc.

PC Board Product Assurance Testing

PC Board Product Assurance Testing

New Equipment | Test Equipment

Military-style laboratory services to validate bare boards for product assurance. Testing for delamination, voids, copper thickness, hole quality, proper stack-up, etc. Customer receives all cross-section pucks, boards and laboratory report with reco

DIVSYS International-ICAPE, LLC

Electronics Forum: copper delamination (44)

copper land delamination

Electronics Forum | Mon Nov 15 14:40:38 EST 1999 | Bob Smith

Hi, I have a problem I've never seen before so I hope someone here can help. A recent batch of PCBs arrived where the copper lands delaminate with a small pull. Normally you have to pull pretty hard and the whole land comes off the substrate. These

Re: copper land delamination

Electronics Forum | Thu Nov 25 20:28:43 EST 1999 | cklau

hello, One way to prevent copper land delamination is to applied Anchoring spurs also referred to as "tie-down tabs" or "rabbit ears".These are a metal projection around a land.This features is fully captured by the cover lay (cover coat) that is n

Industry News: copper delamination (8)

IPC APEX EXPO Tackles Buzz-worthy Industry Issues in Free Sessions

Industry News | 2011-11-03 22:26:02.0

They are the subjects of countless headlines and industry tweets - the impact on industry of conflict minerals, embedded technology, process defects and supply line issues such as counterfeit parts - and the topics of two full days’ worth of free BUZZ sessions at IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Industry's Most Baffling Defects No Match For Free Process Defect Clinic At IPC Apex Expo 2012

Industry News | 2011-12-02 18:36:19.0

Manufacturing and quality engineers looking for solutions to process challenges will find answers at the NPL Process Defect Database Clinic at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. Organized by IPC and the National Physical Laboratory (NPL), the free clinic will be held in the exhibit hall to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.

Association Connecting Electronics Industries (IPC)

Technical Library: copper delamination (3)

Influence of Plating Quality on Reliability of Microvias

Technical Library | 2016-05-12 16:29:40.0

Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.

CALCE Center for Advanced Life Cycle Engineering

Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour

Technical Library | 2018-09-21 10:12:53.0

Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.

National Physical Laboratory

Videos: copper delamination (44)

How to Use and Read Humidity Indicator Card Type 2 - Humitector™

How to Use and Read Humidity Indicator Card Type 2 - Humitector™

Videos

Humitector™ Type 2 delivers advanced sustainable attributes including halogen-free*, cobalt dichloride-free, and reduced cobalt dibromide content The use of Type 2 Humidity Indicator Cards with a non-reversible 60% RH spot indicator is preferr

Clariant Cargo & Device Protection

The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring boards using an internationally-recognized program.

The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring boards using an internationally-recognized program.

Videos

This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo

BEST Inc.

Training Courses: copper delamination (2)

IPC-A-600 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-600 Specialist (CIS)

The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.

BEST IPC Training

IPC-A-600 Acceptability of Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)

The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.

PIEK International Education Centre

Events Calendar: copper delamination (41)

IPC-A-600 Operator Certification

Events Calendar | Wed Jun 03 08:00:00 EDT 2015 - Fri Jun 05 16:00:00 EDT 2015 | Cleveland, Ohio USA

IPC-A-600 Operator Certification

BEST Inc.

IPC-A-600 Operator Certification

Events Calendar | Wed Jul 15 00:00:00 EDT 2015 - Fri Jul 17 00:00:00 EDT 2015 | Huntsville, Alabama USA

IPC-A-600 Operator Certification

BEST Inc.

Express Newsletter: copper delamination (148)

Partner Websites: copper delamination (38)


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