Industry Directory: copper foil reflow (10)

Oak Mitsui Inc.

Oak Mitsui Inc.

Industry Directory | Manufacturer of Components

Oak-Mitsui specializes in the development and production of world class performance foils, Aluminum Bonded Copper, and FaradFlex� Buried Capacitance� materials.

Lamar Uk Limited

Lamar Uk Limited

Industry Directory | Distributor

Suppliers to the PCB Industry with a huge range of products including copper clad laminates, drill boards and consumables.

New SMT Equipment: copper foil reflow (296)

MALCOM STA-2 Solder Impurity Tester

MALCOM STA-2 Solder Impurity Tester

New Equipment | Solder Materials

Soldering is now lead-free. Reflow soldering quality with solder paste can be maintained by controlling the furnace temperature or determining the temperature profile on condition that the solder paste material is decided and the materials, surface t

Seika Machinery, Inc.

New Alloy ECOLLOY - The Future Of High Performance Lead Free Silver Free Solder

New Alloy ECOLLOY - The Future Of High Performance Lead Free Silver Free Solder

New Equipment | Solder Materials

Qualitek International, Inc. presents Ecolloy the future of high performance lead free silver free solder. Ecolloy has a higher tensile strength and temperature cycling than SAC 305 and SnCu alloys. Melting range of this new alloy is lower than SnCu

Qualitek International, Inc.

Electronics Forum: copper foil reflow (496)

Migration of copper during reflow process

Electronics Forum | Tue Mar 18 17:23:40 EDT 2008 | dkntb

Any member in here has experienced of copper migration from BGA's substrate to PWB during eutectic soldering reflow process, which resulted in brittle solder joints??? We have one customer notified us that our PBGA with DSOP substrate having copper m

Lead free tin copper only

Electronics Forum | Sun Feb 05 08:41:15 EST 2006 | Cmiller

Are you refering to reflow soldering or wave soldering? Brian, do you have any data to support that SAC305 is more reliable than Tin-Copper-Nickel? NEMI reccomended SAC type alloys for reflow and Tin-Copper for wave. See: http://circuitsassembly.

Used SMT Equipment: copper foil reflow (2)

Energy Tech TrioTek Model 2250

Energy Tech TrioTek Model 2250

Used SMT Equipment | Soldering - Reflow

TrioTek: Ultraviolet UV Curing, IR Thermal Curing, Moisture Curing for encapsulants, adhesives, conformal coatings and potting compounds TrioTek™ inline curing ovens from ETS are ideal for medium to high-volume curing or drying of encapsulants, con

TrioTek

Speedline Omni 7

Speedline Omni 7

Used SMT Equipment | Soldering - Reflow

Speedline Omni 7 Reflow Oven Model: Omni 7 Vintage: 2003 Warranty: 30 Days THE OMNIFLO Each OmniFlo model features the same design criteria and the same robust construction. Our central design theme is to minimize the number of parts in the

Recon Inc

Industry News: copper foil reflow (224)

Naveen Ravindran, ZESTRON Americas, to Present at SMTAI

Industry News | 2017-09-07 17:45:03.0

ZESTRON is pleased to announce that Naveen Ravindran, M.S.Ch.E, Application Engineer will present “PCB Surface Finishes and the Cleaning Process - A Compatibility Study” at SMTA International 2017, in Rosemont, IL.

ZESTRON Americas

Seika Machinery to Exhibit at SMTA Dallas 2009

Industry News | 2009-03-02 00:10:24.0

TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.

Seika Machinery, Inc.

Parts & Supplies: copper foil reflow (25)

Fuji K3031M K3031T

Fuji K3031M K3031T

Parts & Supplies | Assembly Accessories

CNSMT K3031M K3031T DAPHNE EPONEX NO.2 2.5 / 16KKG CNSMT K3031M K3031T DAPHNE EPONEX NO.2 2.5 / 16KKG SFN0AS JUKI Stick feeder for Surface Mounted Technology Mach SFN1AS JUKI Stick feeder for JUKI KE-2050 KE-2060 KE-2070 KE SFN2AS JUKI Stick

CNSMT CO.LTD

Fuji K3031M K3031T

Fuji K3031M K3031T

Parts & Supplies | Assembly Accessories

CNSMT K3031M K3031T DAPHNE EPONEX NO.2 2.5 / 16KKG CNSMT K3031M K3031T DAPHNE EPONEX NO.2 2.5 / 16KKG SFN0AS JUKI Stick feeder for Surface Mounted Technology Mach SFN1AS JUKI Stick feeder for JUKI KE-2050 KE-2060 KE-2070 KE SFN2AS JUKI Stick

CNSMT CO.LTD

Technical Library: copper foil reflow (299)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Videos: copper foil reflow (18)

Ecolloy A High Performance Lead Free Silver Free Alloy Alternative

Ecolloy A High Performance Lead Free Silver Free Alloy Alternative

Videos

Qualitek International, Inc. presents Ecolloy the future of high performance lead free solder. Ecolloy has a higher tensile strength and temperature cycling than SAC 305 and SnCu alloys. Melting range of this new alloy is lower than SnCu alloys so it

Qualitek International, Inc.

auto pcb screen printer, auto smt stencil printer , auto solder paste printer , stencil printing machine, PCB solder paste printer

auto pcb screen printer, auto smt stencil printer , auto solder paste printer , stencil printing machine, PCB solder paste printer

Videos

PCB solder paste printer for SMT is needed to screen print solder paste onto the printed circuit board (PCB) before placement of surface mount components (SMD) for Reflow Soldering. Automatic PCB solder paste screen printer with pecial

ASCEN Technology

Events Calendar: copper foil reflow (1)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Resumes: copper foil reflow (5)

3+ years of experience in the PCB CAM engineering

Career Center | Erode, Tamilnadu India | Engineering

Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou

Sales Manager

Career Center | Shen Zhen, China | Management,Sales/Marketing

Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe

Express Newsletter: copper foil reflow (831)

SMTnet Express - August 16, 2018

SMTnet Express, August 16, 2018, Subscribers: 31,259, Companies: 11,015, Users: 25,092 Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method Kazuki Kammuri, Atsushi Miki, Hiroki Takeuchi; JX

SMTnet Express - November 22, 2017

SMTnet Express, November 22, 2017, Subscribers: 31,034, Companies: 10,792, Users: 24,082 Factors Affecting the Adhesion of Thin Film Copper on Polyimide David Ciufo, Hsin-Yi Tsai and Michael J. Carmody; Intrinsiq Materials Inc. The use of copper

Partner Websites: copper foil reflow (650)

215607 137516 DEK Screen Printer 520mm Foil Shim Board Clamp

Goldland Electronic Technology Company Limited | https://www.feedersupplier.com/sale-13119468-215607-137516-dek-screen-printer-520mm-foil-shim-board-clamp.html

Machine Spare Parts SMT Reflow Oven About Us Factory Tour Quality Control Contact Us Products Home / Products / SMT Screen Printer Parts 215607 137516 DEK Screen Printer 520mm Foil Shim Board Clamp Basic

Goldland Electronic Technology Company Limited

Nitrogen Reflow Oven-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,4161&url=_print

  Lead-free era makes whether need nitrogen in reflow a hot topic . As the lead-free solder flow resistance, wettability is not as good as lead solder, especially when the circuit board pad processed with OSP (organic protective film bare copper), the pad


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