Industry News | 2014-02-18 17:01:34.0
The SMTA is pleased to announce the program for the 2014 International Conference on Soldering and Reliability being held May 13-15 in Toronto, Ontario, Canada.
Industry News | 2013-07-23 16:35:08.0
The SMTA announced that the Evolving Technologies Summit will be held on October 14, 2013 as a focused symposium at SMTA International in Fort Worth, Texas.
Industry News | 2020-01-08 16:51:58.0
The SMTA Capital Chapter is excited to host a Chapter Meeting on February 20th from 5:00 PM to 7:30 PM at PACE Worldwide in Elkridge, MD. Jason Fullerton, MacDermid Alpha Electronic Solutions, will be presenting “Advances in Lead-Free Solder Technologies for High Reliability Applications.”
Industry News | 2015-02-04 18:05:58.0
he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
Industry News | 2018-08-16 19:58:50.0
The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2021-03-25 15:48:41.0
The SMTA Officer team is excited to provide our members with a new webinar by Dr. Nathan Blattau, R&D Fellow at Ansys, Inc., on "Next Generation Lead Free Solders for High Reliability and SMT Yield improvement in Client Computing Systems." The webinar will be on Tuesday, April 6th at 12:00 PM EST and will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.
Industry News | 2003-06-11 08:00:48.0
IPC has begun a comprehensive study of the three leading lead-free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead-free assembly.
Industry News | 2017-08-06 19:39:48.0
The SMTA Capital Chapter is pleased to announce that Gerry Partida of Summit Interconnect, will present “Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Industry News | 2012-06-13 08:49:05.0
On Tuesday, June 5, 2012, leaders of IPC’s Environment, Health and Safety (EHS) Committee met with senior U.S. Environmental Protection Agency (EPA) staff to discuss regulatory relief for printed board manufacturing.
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