Industry Directory | Manufacturer
1 to 30-layer FR-4 PCBs with HDI, Aluminum based PCBs, Copper based PCBs & Iron based PCBs; - Prototype and mass production of High-Mix, Medium or Low-Volume orders. - Quality Guaranteed.
Industry Directory | Manufacturer
A sheet metal fabricator. We punch sheet metal, form, weld, paint and silk screen all on premises. We specialize in rack panels for electronics, elctronic enclosures, and sheet metal chassis.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
New Equipment | Solder Materials
I.C.T | Antioxidant Silver Soldering Tin Lead Free Solder Bar for Solder Wave ❙ Introduction I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that delive
Electronics Forum | Mon Dec 05 17:46:10 EST 2022 | SMTA-64387381
Does anyone have experience with routing through areas of PCBs with Cu traces running through them. Trying concept to design in functional "wing" portions to our main board in an effort to get 2 in 1 functional boards - a fully functional main PCB
Electronics Forum | Sat Oct 21 03:55:14 EDT 2000 | DL
Dennis, I've seen this before, and in our case we didn't need to seal the edges because there was no concern of shorting or anything in the end product, this is a choice you will have to make, Does your end product have any protrusions or mounting h
Used SMT Equipment | In-Circuit Testers
Agilent N2620A FrameScope Pro N2620A FrameScope Pro Handheld Gigabit Ethernet Network Performance Analyzer The FrameScope Pro is Agilent's handheld 10/100/1000 Mbit/s Ethernet deployment and troubleshooting tool. With the FrameScope Pro, tech
Used SMT Equipment | In-Circuit Testers
Agilent N2620A FrameScope ProN2620A FrameScope Pro Handheld Gigabit Ethernet Network Performance Analyzer The FrameScope Pro is Agilent's handheld 10/100/1000 Mbit/s Ethernet deployment and troubleshooting tool. With the FrameScope Pro, technicians d
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2014-10-01 15:59:00.0
PCB provider Cirtech Electronics located in Cape Town, South Africa will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid. Bidding for the auction will open promptly at 8:00am PDT on October 7th, 2014 and will begin closing at 6:00am PDT on October 14th, 2014.
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Parts & Supplies | Pick and Place/Feeders
FUJI W08C feeder parts PP02584 Other Fuji parts: PM03542 PIN wire rope guide PIN (steel) H5265A BOLT, HEX SOCKET hex screw W1039A WASHER, FLAT M2 flat pad PM08CB2 BOLT pinion fixed PIN W10076 WASHER gasket PP02584 PLATE pinion blank PM06AS3 P
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Parts & Supplies | Pick and Place/Feeders
FUJI PZ37451 SPRING Other Fuji parts: PM56403 BOLT sensor switch fixing screw N1077H NUT, HEX M3 nut AA19N05 CLAMPER wire rope PZ02320 SPRING Wire Rope Spring PM03542 PIN wire rope guide PIN (steel) H5265A BOLT, HEX SOCKET hex screw W1039A WA
Technical Library | 2014-11-13 19:23:50.0
With increasing power loss of electrical components, thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advances in semiconductor technology, particularly in the regime of high-power components, the temperature dependence of the long-term reliability is a critical parameter and has to be considered with highest possible care during the design phase (...) The aim of this paper is to give a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs. Furthermore, attention will be turned on the development of copper filled thermal vias in thin board constructions...
Technical Library | 2020-09-02 22:02:13.0
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI) products migrating away from the current subtractive processes towards a more technically adept technique, based on an advanced modified Semi Additive Process (amSAP). This pattern plate process enables line and space features in the region of 20um to be produced, in combination with fully filled, laser formed microvias. However, in order to achieve these process demands, a step change in the performance of the chemical processes used for metallization of the microvia is essential. In the electroless Copper process, the critical activator step often risks cross contamination by the preceding chemistries. Such events can lead to uncontrolled buildup of Palladium rich residues on the panel surface, which can subsequently inhibit etching and lead to short circuits between the final traces. In addition, with more demands being placed on the microvia, the need for a high uniformity Copper layer has become paramount, unfortunately, as microvia shape is often far from ideal, the deposition or "throw" characteristics of the Copper bath itself are also of critical importance. This "high throwing power" is influential elsewhere in the amSAP technique, as it leads to a thinner surface Copper layer, which aids the etching process and enables the ultra-fine features being demanded by today's high end PCB applications. This paper discusses the performance of an electroless Copper plating process that has been developed to satisfy the needs of challenging amSAP applications. Through the use of a radical predip chemistry, the formation, build up and deposition of uncontrolled Pd residues arising from activator contamination has been virtually eradicated. With the adoption of a high throwing power Copper bath, sub 30um features are enabled and microvia coverage is shown to be greatly improved, even in complex via shapes which would otherwise suffer from uneven coverage and risk premature failure in service. Through a mixture of development and production data, this paper aims to highlight the benefits and robust performance of the new electroless Copper process for amSAP applications
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
(PCBs) is the corrosion of copper metallization and
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. The solder mask is a layer of polymer that electrically insulates the copper layer, preventing it from short-circuiting. The silkscreen, or the legend or nomenclature, shows information about the PCB
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Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Intermetallic Growth on PCB Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead
