New Equipment | Industrial Automation
give me a inquiry, i will get you back immediately or in 9 hours. if you have a large purchase, we can make a discount. Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851
New Equipment | Industrial Automation
give me a inquiry, i will get you back immediately or in 9 hours. if you have a large purchase, we can make a discount. Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851
Electronics Forum | Fri Apr 16 11:03:35 EDT 2004 | davef
Your copper corrosion is not good. It indicates that you have not done a good job in cleaning. [We assume this is a medium green color, not unlike the color of the solder mask on your board, that is almost like a translucent lacquer; rather than th
Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef
Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa
Industry News | 2009-04-23 20:39:41.0
NASHVILLE � April 2009 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it has won a remarkable six awards on two continents during the last year.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Technical Library | 2019-02-13 13:45:11.0
Development of information and telecommunications network is outstanding in recent years, and it is required for the related equipment such as communication base stations, servers and routers, to process huge amount of data in no time. As an electrical signal becomes faster and faster, how to prevent signal delay by transmission loss is a big issue for Printed Circuit Boards (PCB) loaded on such equipments. There are two main factors as the cause of transmission loss; dielectric loss and conductor loss. To decrease the dielectric loss, materials having low dielectric constant and low loss tangent have been developed. On the other hand, reducing the surface roughness of the copper foil itself to be used or minimizing the surface roughness by modifying surface treatment process of the conductor patterns before lamination is considered to be effective in order to decrease the conductor loss. However, there is a possibility that reduction in the surface roughness of the conductor patterns will lead to the decrease in adhesion of conductor patterns to dielectric resin and result in the deterioration of reliability of PCB itself. In this paper, we will show the evaluation results of adhesion performance and electrical properties using certain type of dielectric material for high frequency PCB, several types of copper foil and several surface treatment processes of the conductor patterns. Moreover, we will indicate a technique from the aspect of surface treatment process in order to ensure reliability and, at the same time, to prevent signal delay at the signal frequency over 20 GHz.
Events Calendar | Tue Mar 07 00:00:00 EST 2017 - Thu Mar 09 00:00:00 EST 2017 | Fountain Hills, Arizona USA
13th International Conference and Exhibition on Device Packaging
International Microelectronics Assembly and Packaging Society (IMAPS)
Developing a Reliable Lead-free SMT Assembly Process Developing a Reliable Lead-free SMT Assembly Process What are the key process requirements to achieve reliable lead-free SMT assembly? Lead-free SMT can be achieved reliably if several
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/2d-x-ray-inspection
. Optical image showing the word IBEX created as a mosaic of random thicknesses of silver and copper foils (top); X ray transmission image showing that it is not possible to distinguish between the foils using absorption contrast alone (middle
ACI Technologies, Inc. | https://www.aciusa.org/wp-content/uploads/2021/07/techtip8-2015.pdf
. • The paste reflowed uniformly and covered leads as per IPC-A- 610 class 3 specifications. No apparent skips or de-wetting was noticed on resistors, capacitors, or leaded chip devices
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