| https://pcbasupplies.com/thermaltronics-m8bvf010h-bevel-60deg-1-00mm-0-04-tin-area-face-only-power-plus/
: Thermaltronics Description Additional information Description Thermaltronics M8BVF010H Bevel 60deg 1.00mm (0.04″), Tin Area Face Only, Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating
| https://pcbasupplies.com/thermaltronics-m6bvf010h-bevel-60deg-1-00mm-0-04-tin-area-face-only-power-plus/
: Thermaltronics Description Additional information Description Thermaltronics M6BVF010H Bevel 60deg 1.00mm (0.04″), Tin Area Face Only, Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating
| https://pcbasupplies.com/thermaltronics-m6bvf060h-bevel-45deg-6-00mm-0-24-tin-area-face-only-power-plus/
: Thermaltronics Description Additional information Description Thermaltronics M6BVF060H Bevel 45deg 6.00mm (0.24″), Tin Area Face Only, Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating
| https://pcbasupplies.com/thermaltronics-m8ds526h-knife-4-50mm-0-177-increased-tin-area-6-1mm-0-24-power-plus/
: Thermaltronics Description Additional information Description Thermaltronics M8DS526H Knife 4.50mm (0.177″), Increased Tin Area 6.1mm (0.24″), Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating
| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Intermetallic Growth on PCB Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead
| http://etasmt.com/te_news_bulletin/2021-08-31/23575.chtml
:16 Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad (from hot air leveling or other pcb solder-coating method
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23575.chtml
:20 Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad (from hot air leveling or other pcb solder-coating method
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
. Once solidified, it exhibits large grains with a fine and uniform two-phase eutectic colony. Tin-Copper. Sn-0.7%Cu is the eutectic composition of the Sn-Cu binary system
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
(HDI) Finish Hole Size • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) True Hole Position +/-.0015" Finish Hole Size Tolerance • PTH - +/-.0015" • Non-PTH - +/-.001" Aspect Ratio (Board Tks./FHS) 30 Heavy Copper
