Industry Directory: corner bonding (2)

ALLTEMATED, INC.

ALLTEMATED, INC.

Industry Directory | Manufacturer of Assembly Material

Alltemated sets the standard for tape and reel packaging, IC programming, lead trim/forming, bake and dry-pack services and carrier tape manufacturing.

Tianjin Reains Technologies Co., Ltd

Industry Directory | Adhesives / Dispensing

Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.

New SMT Equipment: corner bonding (9)

DJ-9000 DispenseJet Jet Technology

DJ-9000 DispenseJet Jet Technology

New Equipment | Dispensing

Jetting is the best way to dispense many fluids quickly and accurately. The DJ-9000 has a high shot-generation rate, can be cleaned in a few minutes, and has fast changeover of wetted parts. Speed, Flexibility, Process Control, Experience Based on

Nordson ASYMTEK

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

New Equipment | Dispensing

The next level of refinement, the Quantum™ Q-6800 Series is Nordson ASYMTEK’s latest high-performance, large-format dispensing platform. The Quantum platform has the same large dispense area as Axiom with a laser height sensor (LHS) while new sophis

Nordson ASYMTEK

Electronics Forum: corner bonding (10)

BGA chip corner epoxy / adhesive?

Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest

Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond

BGA chip corner epoxy / adhesive?

Electronics Forum | Wed Dec 06 21:59:37 EST 2006 | SMTrework

Hello, we rework BGA packages that come back from the field. I've seen on occasion a black and or red "epoxy" substance from the manufacturer on the corner of some board's BGA chips that I imagine are applied to increase corner bond of the chip to th

Industry News: corner bonding (9)

Share Your Research at SMTA International 2016!

Industry News | 2015-11-25 16:58:05.0

On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.

Surface Mount Technology Association (SMTA)

Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

Headpcb

Technical Library: corner bonding (62)

Conductive Adhesive Dispensing, Process Considerations

Technical Library | 1999-08-27 09:24:56.0

Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.

Nordson ASYMTEK

Dam and Fill Encapsulation for Microelectronic Packages

Technical Library | 1999-08-27 09:29:49.0

Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...

Nordson ASYMTEK

Videos: corner bonding (3)

Dam and Fill with dual valves. Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity.

Dam and Fill with dual valves. Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity.

Videos

Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com

Nordson ASYMTEK

PCB pad repair technique demonstrated using the 2-part epoxy method.

PCB pad repair technique demonstrated using the 2-part epoxy method.

Videos

PCB pad repair technique demonstrated using the 2-part epoxy method. More on this PCB pad repair technique: http://www.solder.net/services/pcb-repair/pad-and-trace-repair/ More on the recommended epoxy: http://www.soldertools.net/pcb-repair-epoxy-r

BEST Inc.

Events Calendar: corner bonding (1)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Express Newsletter: corner bonding (125)

Partner Websites: corner bonding (829)

Applications Corner - Nordson ASYMTEK

Nordson ASYMTEK | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner?page=3

Applications Corner Nordson ASYMTEK ASYMTEK Products Corporate Global Directory Languages Division Only All of Nordson Fluid Dispensing Systems Jets

Nordson ASYMTEK

Call for Papers - SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm

@smta.org Advanced Packaging/Components: 2.5/3D Packaging and Integration BGA/CSP Biomedical Packaging Component Storage Connector Technology Copper Pillars Copper Wire Bonding Diffusion Bonding Embedded and Miniature Passives Environmental

Surface Mount Technology Association (SMTA)


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