Industry Directory | Manufacturer
Rapid Prototype Sheet Metal - Rapid prototypes for sheet metal parts. Fast Quotes & Precision Fabrication from 3D CAD data. From simple brackets & covers to complex sheet metal parts.
Industry Directory | Manufacturer's Representative
Camtech Circuits is ISO9001:2008 and UL certificated. We strictly implement ISO9001 quality management system. Each equipment, every process has its own Manual of Engineering Instructions. No matter p
YAMAHA YG100R HIGH SPEED PICK AND PLACE MACHINE Model YG100RA(FNC TYPE )/YG100RB(SF TYPE) Object substrate L50×W50mm ～L510×W460mm Mounting efficiency 24000CPH/CHIP (
Manual vision measuring machine suitable for measuring applications of multi-variety, complex dimensions and demanding measuring accuracy , This vision measuring instrument can be applied to a variety of molds, aircraft, cars, mob
Electronics Forum | Fri May 13 02:43:21 EDT 2016 | karts22
Hi, We have several fixtures for GenRad 228x tester and would like to change sensor plates as they are quite worn. The problem is that 3 fixtures have different plate sizes for the same IC, side length is 10-12mm. What would be the best size for sens
Electronics Forum | Thu Aug 14 15:07:43 EDT 2014 | rgeary
Yes, thank you. Found out that machine ran over two parts to tall and damaged the cover plate over the centering.
Used SMT Equipment | Pick and Place/Feeders
Yamaha YG100RA/RB ,YG100RA ,YG100RB, YG100RA/RB modular high speed SMT machine SPECIFICATION : >24,000CPH(equivalent to 0.15 SEC /CHIP) high speed mount capability :(* best condition) >Can correspond to 0402 CHIP ~ □45mm components, lon
Used SMT Equipment | SMT Equipment
Product name: YS100 high speed universal module chip mounter Product number: YS100 Products in detail The characteristics of 25000 CPH (equivalent to 0.14 seconds/CHIP: best conditions) ability of high speed SMT All the time, SMT absolute a
Industry News | 2013-07-22 09:54:27.0
GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.
Industry News | 2003-06-25 12:28:40.0
The chart includes a variety of diagrams, tables, and ratio charts for RF Emissions; Direct RF Power Injection; Bulk Current Injection (BCI); ESD and Transients; as well as TEM Cell and Stripline testing.
Parts & Supplies | Assembly Accessories
YAMAHA KSUN SMT Original Used YG100 KHL-M4592-00 Vacuum plate More Yamaha parts in stock KM9-M7107-00XSHFT, HEAD ASSYYV100II KM9-M7106-00XSHAFT HEAD ASSY YV100II KV8-M713S-A0X STD.SHAFT2,SPARE YV100X KV8-M712S-A0X STD.SHAFT1,SPARE Y
Parts & Supplies | SMT Equipment
YAMAHA KHY-M221A-A0 COVER,DUCT ASSY. YG12 YS12 1-1 KHY-M221A-A0 COVER,DUCT ASSY. 1 2 KGT-M2266-10 PLATE,NUT 1 3 KGT-M2268-00 BRACKET 1,TAPE 1 3-1 KHY-M2268-00 BRACKET 1,TAPE 1 4 KHN-M22F8-00 WASHER,SWR08 16 5 KHW-M2269-00 BRACKET 2,TAPE 1
Technical Library | 2020-09-02 22:14:36.0
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The printed circuit board (PCB) must support this trend as the central interconnection of the system. There are several options for fine line circuitry. A typical fine line circuit PCB product using copper foil technology, such as the modified semi-additive process (mSAP), uses a thin base copper layer made by pre-etching. The ultrathin copper foil process (SAP with ultrathin copper foil) is facing a technology limit for the miniaturization due to copper roughness and thickness control. The SAP process using sputtered copper is a solution, but the sputtering process is expensive and has issues with via plating. SAP using electroless copper deposition is another solution, but the process involved is challenged to achieve adequate adhesion and insulation between fine-pitch circuitries. A novel catalyst system--liquid metal ink (LMI)--has been developed that avoids these concerns and promotes a very controlled copper thickness over the substrate, targeting next generation high density interconnect (HDI) to wafer-level packaging substrates and enabling 5-micron level feature sizes. This novel catalyst has a unique feature, high density, and atomic-level deposition. Whereas conventional tin-palladium catalyst systems provide sporadic coverage over the substrate surface, the deposited catalyst covers the entire substrate surface. As a result, the catalyst enables improved uniformity of the copper deposition starting from the initial stage while providing higher adhesion and higher insulation resistance compared to the traditional catalysts used in SAP processes. This article discusses this new catalyst process, which both proposes a typical SAP process using the new catalyst and demonstrates the reliability improvements through a comparison between a new SAP PCB process and a conventional SAP PCB process.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
40001403 COVER RUL 40001404 COVER RUR 40001406 COVER CUL(L) 40001408 COVER CUR 40001409 COVER CUR(L) 40001411 COVER CUC 40001412 COVER CUC(L) 40001415 COVER SUL(L) 40001418 COVER SUR(L) 40001421 SAFETY COVER FRAME R 40001422 SCW PLATE F 40
E1347721000 KB STAND R E1348700000 SAFETY COVER STOPPER E1348715000 FRAME DL E1348721000 KB STAND L E1348725000 CONNECTOR BRACKET E1349715000 FRAME ER E1349721000 KEYBOARD HINGE E1350721000 OPERATION PANEL REAR COVER E13507260A0 YF P
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Career Center | Costa Mesa, California USA | Engineering,Sales/Marketing,Technical Support
SALES- Growth opportunity to join a growing Manufacturers Rep firm. Looking for an aggressive sales professional to cover San Diego and the Mexican boarder areas of Tijuana, Tecate and Mexicali. Previous sales experience required selling to ele
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Continued From Previous Page PRINTED CIRCUIT BOARD FABRICATION BASICS AN OUTLINE Earl Moon Proof Of Design (POD) 8. PLATING (AND
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/00341749-01-side-cover-plate-202970?page=23&category=1125
SIEMENS Side Cover Plate 00341749-01 | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products SIEMENS Side Cover Plate Public Pricelist Public Pricelist Side Cover Plate
KingFei SMT Tech | http://www.smtspare-parts.com/sale-13335320-am03-025649a-d-geartrain-m-08-assy-smasung-v8mm-feeder-cover-plate.html
AM03-025649A D-GEARTRAIN M 08 ASSY Smasung V8mm Feeder Cover Plate Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
