Industry Directory | Consultant / Service Provider
We are your obsolete industrial product specialists. Our inventory includes VME, cPCI, ATCA, SBCs and much more industrial electronics
Visit our web site to view our complete product line. http://www.dyneng.com
Used SMT Equipment | Pick and Place/Feeders
JUKI Mounter fx-1r parameters: Board size: 410*360mm Component height: 6mm 33,000CPH：chip (optimal) / 25,000CPH: chip (IPC 9850) Two independent multi-nozzle laser heads (8 total nozzles) from 0603 （0201） to 20mm square components or 26.5×
Used SMT Equipment | SMT Equipment
Looking for CP7 / CP8 series controller card 1.NAME: SERVO BOARD 伺服卡 TYPE: XMP-CPCI-12-24V.FM (Part No. T001-0005) CODE No. AEEPN5600 2.I/O BOARD TYPE: HIMC-1623B CODE No. K2089H Please email to customerst@163.com
Industry News | 2018-10-29 11:22:27.0
ADLINK Technology today released two new CompactPCI® 2.0 processor blades, the cPCI-3630 and cPCI-6636. 3U cPCI-3630 and 6U cPCI-6636 further enhance ADLINK’s extensive, rugged CompactPCI processor blade portfolio and provide technology upgrade solutions for railway transportation, military, aviation and industrial automation.
Industry News | 2016-09-29 23:16:55.0
ADLINK Technology introduces the cPCI-6940 processor blade featuring the Intel® Xeon® processor D-1500 and AMD Radeon™ E8860 embedded GPU. The cPCI-6940 6U CompactPCI processor blade offers up to 16-core computing power and high-performance graphics in a robust design. With an extended operating temperature range of -45°C to 85°C and 16GB of DDR4 soldered memory, the cPCI-6940 is ideal for the rugged environments encountered by military field vehicles and naval or aerospace carriers.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
40001403 COVER RUL 40001404 COVER RUR 40001406 COVER CUL(L) 40001408 COVER CUR 40001409 COVER CUR(L) 40001411 COVER CUC 40001412 COVER CUC(L) 40001415 COVER SUL(L) 40001418 COVER SUR(L) 40001421 SAFETY COVER FRAME R 40001422 SCW PLATE F 40
03010415S01 Tension Spring Z-051GX 03010444S02 Hose, Placement Circuit 3*6*125 03010445S01 Hose, Query Placem.Circ.,6-Nozzle Head 03010482-01 LINE FILTER 03010496-01 CABLE FOR MOTOR MTC 2 03010513-01 CONTACTOR 3RT1015-1JB42 03010565-01 CALIBRAT
| https://zksale.en.ecplaza.net/offers/juki-xmp-cpci-juki-40003259_8936242
Juki XMP CPCI JUKI 40003259 - ZK Electronic Technology Co., Limited For Buyers New Products New Selling Leads Post Buying Requests Product Videos Korean Suppliers Vetted For Sellers New Buying Requests Display New Products Post Selling Leads Premium
| https://www.wesource.com/miscellaneous/digital-power-pci-power-supply-cpci-ac-6u-500-id-001681-9/22/
Digital Power PCI Power Supply CPCI-AC-6U-500 ID_001681 (9/22): World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US
.gif)
