159 crack connector pin paste results

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. • On the data sheet of the connector, it indicates Gold Flash Overall for contact plating. – Nowhere does the data sheet document the gold thickness

| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT

| http://etasmt.com/cc?ID=te_news_industry,23961&url=_print

High Speed High Density Open Pin Field Array, has up to 500 I/O contact pins with a solder charge termination. This type of connector looks like a standard BGA type of SMT device

SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?pageID=newsList&ID=te_news_industry,0&pNum=6

? Show Details The Application of the Pin-in-Paste Reflow Process The Application of the Pin-in-Paste Reflow Process Show Details Case study

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT

| http://etasmt.com:9060/te_news_industry/2021-08-31/23961.chtml

.050" SEARAY™ High Speed High Density Open Pin Field Array, has up to 500 I/O contact pins with a solder charge termination. This type of connector looks like a standard BGA type of SMT device

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT

| http://etasmt.com/te_news_industry/2021-08-31/23961.chtml

. •  Larger pin count devices require lead pitches on 0.65 mm, 0.5 mm or 0.3 mm •  Therefore at these pitches leads are very fragile and susceptible to damage

| https://www.eptac.com/wp-content/uploads/2013/08/eptac_08_21_13-1.pdf

•  Burnt material is carbonized and potentially conductive which would allow electrical leakage, reducing insulation resistance •  If the connector pin is burnt, it may change the grain structure of the pin making the pin more brittle, which could impact long term reliability 15 Toe Fillet Requirement

| https://www.eptac.com/wp-content/uploads/2013/06/eptac_07_17_13.pdf

•  Burnt material is carbonized and potentially conductive which would allow electrical leakage, reducing insulation resistance •  If the connector pin is burnt, it may change the grain structure of the pin making the pin more brittle, which could impact long term reliability 15 Toe Fillet Requirement

| https://www.eptac.com/wp-content/uploads/2021/11/eptac_07_17_13.pdf

Yamaha I-Pulse YG100 YG200 YV100X SMT Nozzles P033 Nozzle SMT Nozzle

| https://www.feedersupplier.com/sale-14821528-yamaha-i-pulse-yg100-yg200-yv100x-smt-nozzles-p033-nozzle-smt-nozzle.html

. 1 KHJ-MC26E-00 SPRING,P/O LEVER 1 90990-09J008 SCREW,FLAT HEAD 7 KLJ-MC281-00 HANDLE W 1 91317-04010 BOLT HEX.SOCKET HEAD 1 KHJ-MC1A9-00 CONNECTOR,BOARD 1 90166-02JA06 SCREW,PAN HEAD 2 KLJ-MC1AM-00 SHIELD,CONNECTOR 1 99480-03010 PIN,PARALLEL 1 99480-04022 PIN,PARALLEL 2 99480-05012 PIN,PARALLEL 1 99480-05018