Electronics Forum | Sat Feb 02 09:33:33 EST 2002 | davef
�8.4.2, Cracking Of Soldered Joints in the epic "Soldering In Electronics" by RJ Klein Wassink [Electrochemical Publications,ISBN 0 901150 24 X] covers cracking differented by: * Overloading * Creep * Fatigue You can't go wrong by starting there.
Electronics Forum | Fri Feb 01 14:23:47 EST 2002 | delnosa
Looking for help on getting information on understanding the physics of micro-fracture growth rate within the BGA ball (or solder joints in general). Hoping to find a fairly straight forward study on the concept/theory of this topic. I'm not a meta
Electronics Forum | Wed Aug 10 09:01:15 EDT 2005 | fctassembly
Hello Joseph, Sorry for the bad news but microcracking is a well known potential condition occuring with the SAC305 alloy. Microcracking is a condition being seen with many joints soldered with the SAC305 alloy. It is technically a shrinkage cavity
Electronics Forum | Fri May 12 12:07:10 EDT 2006 | solderiron
The kester better known as KY'd Sn/Cu has more copper intermetallic growth over time, dissolves copper from the board faster so repairing and touchup can damage board. Bridges more than SN100c. Does not thermal cycle well. Has shrink cracks that can
Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef
1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we
Electronics Forum | Thu Jun 17 22:10:48 EDT 1999 | Earl Moon
| | | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | | | for example: | | | | | | Solder Bridge | | | 1.verify amount of flux been aplied. | | | 2.verify turbulance on
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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