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Electronics Forum | Wed Sep 12 03:43:48 EDT 2018 | vlad_saviuk
Hello, have some problem and interesting, does any body faced with same issue. On most of our products we have NTC thermistor(like on the photo), and during assembly process and handling great amount of components cracked on PCBA so we need to replac
Electronics Forum | Tue Jul 01 07:08:33 EDT 2003 | iman
suggest you check the preheat conditioning in the wavesolder process is sufficient, as this is the main culprit for micro-crack CAPs ?
Industry News | 2018-04-22 19:12:45.0
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2016-10-09 20:43:23.0
The SMTA Capital Chapter is pleased to announce its final meeting of 2016 will be on November 10th, from 5:00 pm to 7:00 pm at Zentech, 6980 Tudsbury Road, Baltimore, Maryland 21244. The focus of this chapter meeting will be “AXI and MXI; How They Complement Each Other” presented by John Travis, Nordson Dage.
Technical Library | 2020-12-07 15:26:06.0
Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature.
Technical Library | 2015-12-23 16:57:27.0
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
(thermal fatigue reliability) by 23%. The photomicrographs taken from orthogonal cross sections of failed thermal cycling samples show that microvoiding and its effects on crack propagation are not always evident or easy to detect using
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=pin 1 on upper Left 390607-01-0 Polarized - Precision Wire-wound Inductors (INDP) - 0 degree=pin 1 (positive) on left side 390579-03-3 Polarized - SOT23-5 - 0 degree
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