Industry Directory | Manufacturer
As trends towards the miniaturization and increased functional integration of electronics, the demands on quality assurance are rising. FISCHER has many coating thickness measurement solutions for the electronics sector.
New Equipment | Solder Materials
SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages
New Equipment | Solder Materials
AIM’s REL22™ alloy is comprised of tin, bismuth, silver, copper, antimony, nickel and trace amounts of elemental grain structure refiners. The alloy provides significantly improved durability for use in applications where thermal shock, vibration and
Electronics Forum | Thu Sep 03 14:21:29 EDT 2009 | davef
Creeping corrosion occurs on bare metal. Most commonly, it is seen on boards with thin protective coatings [eg, bare copper, immersion silver, organic solderability preservative]. Look here: * enthone.com/docs/AlphaSTARCreeping.pdf * circuitree.com
Electronics Forum | Wed Nov 29 21:00:02 EST 2017 | truthseeker
Thx for following up. We have a small PCB in a defense application that has copper sulfide issues. We are using Ion chromotagraphy to track down varions ionic species including sulfates. Your post was a aha moment for me. We have a sample being analy
Industry News | 2017-04-11 21:32:40.0
SMTA and SMART Group announce experts from IBM Corporation and Siemens AG will keynote the Contamination, Cleaning and Coating Conference. The conference is scheduled May 22-24, 2017 at the Radisson Blu Airport Hotel in Amsterdam.
Industry News | 2024-02-26 13:53:23.0
The SMTA Capital Chapter is excited to announce the upcoming SMTA Capital Chapter Expo and Tech Forum, scheduled for March 7th, 2024, at Sweeny Barn in Manassas, Virginia. This event promises a dynamic platform for industry professionals and enthusiasts to explore the latest advancements and trends in electronics manufacturing.
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
Technical Library | 2022-03-16 19:48:18.0
Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, May 10, 2018, Subscribers: 31,023, Companies: 10,930, Users: 24,698 Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards Haley Fu, iNEMI Creep corrosion on printed circuit boards
SMTnet Express, March 17, 2022, Subscribers: 25,805, Companies: 11,547, Users: 27,113 Creep Corrosion On Lead-Free Printed Circuit Boards In High Sulfur Environments The material and process changes required to eliminate lead from
| https://www.eptac.com/faqs/ask-helena-leo/page/5
” or bare copper, does this count? Would it need to be dipped in a solder... Read More SMT Polyphenylene Sulfide (PPS) Film Capacitors and Defects QUESTION Question
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
@smta.org Advanced Packaging/Components: 2.5/3D Packaging and Integration BGA/CSP Biomedical Packaging Component Storage Connector Technology Copper Pillars Copper Wire Bonding Diffusion Bonding Embedded and Miniature Passives Environmental
