Industry Directory | Manufacturer
Manufacturer of UTM, Impact tester, Dynamic Testing System, Creep & Rupture Testing Machine, Compression Tester, Bending Tester, Torsion Tester, Friction Tester, Cupping Tester etc.
Industry Directory | Manufacturer
Jinan Scientific Test Technology Co., Ltd. is a high technology manufacturer and designer devoting on researching and developing, sales and service of material testing instrument in Jinan city, China.
New Equipment | Surface Finish
Increase Yields. Improve Quality. Reduce Rework and Rejects. Enthone provides the world’s most applied and preferred PCB final finishes. Offering the widest selection and deepest knowledge of lead-free compatible finishes, we work with leading OEMs,
Nanovea offers clients worldwide to an unmatched range of Nano, Micro & Macro Mechanical, Metallurgy, Tribology and 3D Non-Contact or AFM materials characterization. Measurements include: Scratch Adhesion, Indentation Hardness, Wear Friction, Elastic
Electronics Forum | Tue Feb 03 09:36:05 EST 2004 | davef
Unfortunately, IPC-D-279, IPC-TM-650, IPC-TR-464, and MIL-STD-810 will not answer your questions, because they do NOT address LF-solders. Even the tests in IPC-9701 need to be modified for LF-solders, because: * LF-solder has different creep behavior
Electronics Forum | Thu Jul 20 16:42:52 EDT 2000 | Bob Willis
Here are the details for the OU Lead-Free Project Introduction The Open University Solder Research Group aims to facilitate the implementation of lead-free solders by evaluating their mechanical properties, especially those which are influential to
Industry News | 2017-04-11 21:32:40.0
SMTA and SMART Group announce experts from IBM Corporation and Siemens AG will keynote the Contamination, Cleaning and Coating Conference. The conference is scheduled May 22-24, 2017 at the Radisson Blu Airport Hotel in Amsterdam.
Industry News | 2018-04-09 19:51:33.0
SMTA Europe announces Session 2 Technical Program on Reliability of Soldered Alloys at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Technical Library | 2021-04-08 00:36:50.0
Understand the sensitivities of the identified factors to Creep Corrosion. Correlate experimental test conditions to environment classification standards.
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, May 10, 2018, Subscribers: 31,023, Companies: 10,930, Users: 24,698 Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards Haley Fu, iNEMI Creep corrosion on printed circuit boards
The Surface Finish Effect on the Creep Corrosion in PCB SMTnet Express May 10, 2012, Subscribers: 25098, Members: Companies: 8865, Users: 33085 The Surface Finish Effect on the Creep Corrosion in PCB First published in the 2012 IPC APEX EXPO
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/courses.cfm
, and improve reliability. Metals can creep rapidly when exposed to harsh environments. The behavior and performance of an alloy is a function of its microstructure
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
; 2) creep failure, or damage caused by a long-lasting permanent load or stress; and 3) fatigue, or damage caused by cyclical loads or stresses
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