Industry Directory | Manufacturer
Excel Dryer manufactures the finest American-made, touchless hand dryers and accessories to help commercial facilities create a hygienic restroom environment.
Failure analysis - Components as well as PC boards, Discretes, Passives ICs - offering X-ray. SEM/EDX -XRF - Cross sectioning complete root cause F/A
Unparalleled throughput and accuracy in an advanced next generation scalable printer platform. The MPM Edison™ stencil printer is ideally suited for the growing Automotive and Smart Device manufacturing markets. The Edison printer i
New Equipment | ESD Control Supplies
Grab-EEZ™ ESD Safe Cleanroom Wipe Dispenser - ESD Safe | ISO Class 5 (Class 100) Cleanroom Compatible | Eliminates wasteful wipe usage and cross-contamination GRAB-EEZ Features: Eliminates Waste – No Loss Of Wipes! Approxim
Electronics Forum | Wed Oct 07 13:15:06 EDT 2015 | markhoch
You can most certainly use the same reflow oven for both leaded and lead-free pastes. Obviously your thermal profiles will be different, as the lead-free paste should have a higher reflow temp. As long as your oven has adequate exhaust and flux manag
Electronics Forum | Tue Jan 20 10:00:25 EST 2015 | TM
Hello We are currently cleaning stencils from both process (PbSn and lead free) in the same cleaning machine. A customer is concerned about cross contamination of lead between stencils. Is there any test kit or tool that you can suggest to test the
Used SMT Equipment | Board Cleaners
Automatic Wash + Rinse + Cleanliness Test + Dry + SPC Lead Free Ready The SMT Series Cleaning Systems include the industry's most powerful batch-format drying system. The SMT series cleaners utilize a combination of convection and radiant heat t
Industry News | 2011-07-26 22:29:00.0
It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.
Industry News | 2011-08-18 21:23:09.0
For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
Technical Library | 2020-09-02 22:02:13.0
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI) products migrating away from the current subtractive processes towards a more technically adept technique, based on an advanced modified Semi Additive Process (amSAP). This pattern plate process enables line and space features in the region of 20um to be produced, in combination with fully filled, laser formed microvias. However, in order to achieve these process demands, a step change in the performance of the chemical processes used for metallization of the microvia is essential. In the electroless Copper process, the critical activator step often risks cross contamination by the preceding chemistries. Such events can lead to uncontrolled buildup of Palladium rich residues on the panel surface, which can subsequently inhibit etching and lead to short circuits between the final traces. In addition, with more demands being placed on the microvia, the need for a high uniformity Copper layer has become paramount, unfortunately, as microvia shape is often far from ideal, the deposition or "throw" characteristics of the Copper bath itself are also of critical importance. This "high throwing power" is influential elsewhere in the amSAP technique, as it leads to a thinner surface Copper layer, which aids the etching process and enables the ultra-fine features being demanded by today's high end PCB applications. This paper discusses the performance of an electroless Copper plating process that has been developed to satisfy the needs of challenging amSAP applications. Through the use of a radical predip chemistry, the formation, build up and deposition of uncontrolled Pd residues arising from activator contamination has been virtually eradicated. With the adoption of a high throwing power Copper bath, sub 30um features are enabled and microvia coverage is shown to be greatly improved, even in complex via shapes which would otherwise suffer from uneven coverage and risk premature failure in service. Through a mixture of development and production data, this paper aims to highlight the benefits and robust performance of the new electroless Copper process for amSAP applications
The GRAB-EEZ was developed to solve a variety of challenges faced by cleanroom wipe users. Feature and benefits include: • Eliminates Waste-No Loss Of Wipes! • Approx. 3X Less Expensive! • No Cross Contamination • User Friendly • Easier To Use wit
HD footage of the Technical Devices Company's Flood Box in operation on a Nu/Clean 800 Series Inline Cleaner
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/products/controllers-and-control-systems/ezspc
): Labor intensive process to clean clogged fixed orifice Slow cycle time when flushing hydraulic circuit through a fixed orifice Potential cross-contamination during the lacquer changeover
| https://ipcapexexpo.org/plan-to-proceed
. The touch-free designs reduce cross-contamination and encourage better hygiene. Social Distancing Capacity charts for all exhibit halls, ballrooms, and meeting rooms will be revised to allow for physical distancing standards
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