Industry Directory | Distributor
You've got problems? We've got parts!! We help keep production lines up and running & take the stress out of procurement. SolTec offers strategic procurement solutions for your supply chain.
New Equipment | Coating Equipment
ASCEN Conformal coating spray equipment provide a is a high-performance film as a protective layer for PCB from the environment, enabling the board to withstand more moisture thereby increasing its surface resistance. It is because of this
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! Easy placement and Soldering of BGAs, CGA's, CSPs, QFPs, LGA's and Other SMD's using this BGA Rework Station with color optical system that h
Electronics Forum | Wed May 25 21:03:30 EDT 2011 | thanhnguyen22
Hi All, I am new the PCBA process fabrication. I have found many cracks in the PCB after we have cross sections analysis. The cracking has same kind of pattern. It happens betwen the solder and the PCB, or between the solder and the part, BUT not be
Electronics Forum | Tue Mar 25 08:13:10 EDT 2008 | davef
Turns out, SMTnet didn't want us to use the name of the town where the publisher of Reference 1 is located.
Used SMT Equipment | In-Circuit Testers
Audio Precision SYS-2722A Advanced Audio Test System The Audio Precision’s System SYS-2722 is the newest generation of PC-controlled audio test and measurement instruments. The 2700 series continues to provide the unmatched distortion and noise
Industry News | 2011-04-29 16:31:39.0
Betting on the generosity of the electronics industry gathered at IPC APEX EXPO recently in Las Vegas, IPC – Association Connecting Electronics Industries® held a raffle to raise funds for the Japan relief fund of the Red Cross. A total of $4,195 was raised from the raffle with 100 percent of the proceeds going to the Japanese Red Cross.
Industry News | 2019-03-03 18:51:58.0
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor this Chapter Tutorial Program on March 28 featuring presentations by Yaad Eliya and Jim Barry of PCB Technologies.
Parts & Supplies | Pick and Place/Feeders
111003 PIVOT ARM 111006 LIMIT SWITCH 111008 LINEAR TRANSDUCER (TXT) 111022 248/249 PRINT HEAD FRAME (MACHINED) 111025 LINEAR GUIDE (SPARES SEE TT 3) 111044 FRONT RH SPRUNG GUIDE SUPPORT 111045 SPACER REAR LOCATION SLIDE. 111046 LOCATION SLIDE
Parts & Supplies | Pick and Place/Feeders
N510028418AA SENSOR EE-SX910-C2J-R 0.5M N610069934AA トレイフィーダ引出部:NPM Tray Feeder Drawing-out Section:NPM N210097292AC BLOCK 0 N610136671AA 全体カバー:NPM-D Whole Cover:NPM-D N610110951AE X-PLATE(F) 0 N210068065AA SPRING 0 N510026562AA WASHER MMSRB6-0
Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
Technical Library | 2016-11-30 15:53:15.0
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.
A demo of the Shuttle Star SV560 A BGA Rework Station.
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
Events Calendar | Tue Jul 18 00:00:00 EDT 2023 - Tue Jul 18 00:00:00 EDT 2023 | Chippewa Falls, Wisconsin USA
UMW Chapter In-Person Event: PCB 101 Workshop and Tour at TTM Chippewa Falls
Events Calendar | Tue Mar 30 00:00:00 EDT 2021 - Tue Mar 30 00:00:00 EDT 2021 | ,
Wisconsin Chapter Webinar: PCB Assembly – Labeling and Marking Technology and Materials
Career Center | Chesterfield, Derbyshire, United Kingdom | Engineering,Maintenance,Quality Control
We are currently recruiting for Surface mount Technicians for our client, based in a town called Clay Cross, which is close to Chesterfield in Derbyshire. The main purpose of the role is the programming and operating of surface mount equipment to
Career Center | Greenville, South Carolina USA | Engineering,Management,Production,Purchasing,Quality Control
Job Purpose Develop the next generation, leading edge products for GE Energy customers. As an Advanced Manufacturing Engineer supporting Gas Turbines, you will: Work in a highly cross-functional environment with Engineering, Manufacturing, Sourci
Career Center | La Crosse, Wisconsin USA | Maintenance,Production,Quality Control,Technical Support
Ability to read,comprehend and troubleshoot ele- ctronic components using blue prints or schema- tics.
Career Center | Round Rock, Texas USA | Management,Production,Purchasing
With Supply Chain and manufacturing management experience that includes startups, turnarounds and major growth initiatives for high-tech electronics firms, I have significant accomplishments in building and efficiently running companies. If your firm
Heller Industries Inc. | https://hellerindustries.com/parts/680030/
680030 - Hinge Pin Cross Bar Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_cross-reference-vendors_topic2660.xml
PCB Libraries Forum : Cross Reference Vendors PCB Libraries Forum : Cross Reference Vendors This is an XML content feed of; PCB Libraries Forum
