Innovative Materials, Superior Performance. Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS complian
Electronics Forum | Thu Sep 14 14:37:45 EDT 2000 | Serrena Carter
Does anyone know where I can find good rule of thumb information on soldering/brazing. I am most interested learning the maximum recommended CTE mismatch between two different materials that thermally cycle between 25-100C.
Electronics Forum | Fri Sep 15 16:37:49 EDT 2000 | Dave F
Sounds like someone aimin� fo tha big hurt, if ya axes me. Two spots to place your lawn darts are: 1 J Hwang in "Modern Solder Technology � " states (p.354) that " � extreme CTE mismatch between silicon IC (~2) and the PCB (~16), solder connections
Industry News | 2018-10-15 18:42:06.0
Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany. At the conference, Karch will deliver his presentation entitled New Solder Alloy with Extended Temperature Range for High-Reliability Applications. He will review test results that demonstrate how a new alloy excels in harsh environments, including wide temperature range and high CTE mismatch. Karch will also share data from existing application qualifications.
Industry News | 2019-03-12 08:54:28.0
(Albany, NY) March 12, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA. Additionally, Dr. Wusheng Yin, President of YINCAE, will be giving a presentation on our unique product, Zero Outgassing and Flux Residue-compatible Underfill.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
Meeting Heat And CTE Challenges Of PCBs And ICs News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Meeting Heat And CTE Challenges Of PCBs And ICs The electronics industry
. These flaws manifest themselves as chips and scratches. Die can experience high levels of stress due to CTE mismatch or flexure of the substrate or board that they are mounted to
?), though copper is is being used more for its superior heat transfer ability and a CTE that matches the solder much better. Is the concern in J-STD-001 that of a CTE mismatch