Industry News: cte mismatch (Page 1 of 1)

Indium Corporation Expert to Present at IMAPS Autumn Conference in Munich

Industry News | 2018-10-15 18:42:06.0

Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany. At the conference, Karch will deliver his presentation entitled New Solder Alloy with Extended Temperature Range for High-Reliability Applications. He will review test results that demonstrate how a new alloy excels in harsh environments, including wide temperature range and high CTE mismatch. Karch will also share data from existing application qualifications.

Indium Corporation

YINCAE Advanced Materials to Exhibit and Present at IMAPS New England Symposium & Expo 2019

Industry News | 2019-03-12 08:54:28.0

(Albany, NY) March 12, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA. Additionally, Dr. Wusheng Yin, President of YINCAE, will be giving a presentation on our unique product, Zero Outgassing and Flux Residue-compatible Underfill.

YINCAE Advanced Materials, LLC.

IMAPS New England Symposium & Expo 2019 is just 4 weeks away! Visit YINCAE on May 7, 2019

Industry News | 2019-04-10 10:19:18.0

(Albany, NY) April 8, 2019 IMAPS New England Symposium & Expo 2019, will be held at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA on May 7, 2019. YINCAE Advanced Materials hopes you will stop by our booth to learn more about YINCAE and the innovative products we have to offer: Solder Joint Encapsulants, Underfill Materials, Die Attach Adhesives, Thermal Interface Materials and more.

YINCAE Advanced Materials, LLC.

MacDermid Alpha to Present Power Package Attach by Silver Sinteringat PCIM Asia Conference in Shanghai

Industry News | 2020-11-06 17:27:12.0

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting the paper, "Power Package Attach by Silver Sintering – Process, Performance & Reliability" at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.

MacDermid Alpha Electronics Solutions

Henkel Product Development Expertise Rewarded at APEX

Industry News | 2010-04-16 01:50:52.0

Building on a rich history of industry honors and product accolades, Henkel Corporation was once again recognized for its innovation initiatives at the recent APEX event in Las Vegas, Nevada. Two of the company’s most recent product advances, Loctite PowerstrateXtreme Printable (PSX-P) and Hysol ECCOBOND CA3556HF, were at the top of the leaderboard for two well-established honors programs.

Henkel Electronic Materials

New Henkel Electrically Conductive Adhesive Cures Fast at Low Temperature; Ideal for Photovoltaic, Automotive and Membrane Switch Applications

Industry News | 2010-05-12 13:12:33.0

Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.

Henkel Electronic Materials


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