Technical Library: cutting 27-board (1)

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Technical Library | 2007-03-08 19:31:10.0

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force.

Henkel Electronic Materials

Express Newsletter: cutting 27-board (106)

SMTnet Express - September 12, 2019

SMTnet Express, September 12, 2019, Subscribers: 32,222, Companies: 10,879, Users: 25,108 Investigation of Cutting Quality and Mitigation Methods for Laser Depaneling of Printed Circuit Boards Credits: LPKF Laser & Electronics There are numerous

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Questions & Answers - PCB Libraries Forum - Page 27

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/questions-answers_forum34&SO=V&OB=desc_page27.html

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Shop - Page 6 of 27 - Lewis and Clark

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Shop - Page 6 of 27 - Lewis and Clark Skip to content My Cart:  0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis


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