Industry News: dage and 4

Electronics Workbench Announces Multisim 7 and Multicap 7 for Professional Circuit Engineers and Designers

Industry News | 2003-05-06 09:05:12.0

New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance

SMTnet

SMTA International Features Package-on-Package (PoP) Design and Assembly Center and Free Webinar

Industry News | 2012-07-12 10:34:27.0

The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.

Surface Mount Technology Association (SMTA)

SMTA International Features Package-on-Package (PoP) Design and Assembly Center and Free Webinar

Industry News | 2012-07-12 10:34:54.0

The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.

Surface Mount Technology Association (SMTA)

IPC Welcomes New Senior Director of Learning and Professional Development

Industry News | 2017-05-04 14:54:40.0

IPC — Association Connecting Electronics Industries® announces the addition of Dave Hernandez, senior director of learning and professional development, to its staff at IPC headquarters in Bannockburn (Chicago), Ill.

Association Connecting Electronics Industries (IPC)

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

The SMTA Capital Chapter’s Expo and Tech Forum to be Held on September 10, 2013

Industry News | 2013-07-30 16:31:28.0

he SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on September 10, 2013 from 9:00 am until 3:30 pm.

Surface Mount Technology Association (SMTA)

Join the Capital Chapter’s Expo and Tech Forum on September 10th

Industry News | 2013-08-26 13:40:02.0

The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on September 10th from 9:00 am until 3:30 pm.

Surface Mount Technology Association (SMTA)

IPC Welcomes New White House Office on Trade and Manufacturing Policy

Industry News | 2017-05-02 12:23:21.0

John Mitchell, president and CEO of IPC – Association Connecting Electronics Industries®, issued the following statement on the April 29 Executive Order by President Donald Trump, creating a new White House Office on Trade and Manufacturing Policy:

Association Connecting Electronics Industries (IPC)

Nordson TEST & INSPECTION enhance their offering with the launch of new products for industrial and pre-clinical X-ray imaging systems

Industry News | 2021-09-26 13:06:24.0

Nordson TEST & INSPECTION division, part of the Nordson Corporation (Nasdaq: NDSN), are pleased to announce the launch of our X-ray Technologies OEM product range for industrial & pre-clinical X-ray imaging systems. This new product line is the result of several months of development work following the acquisition of vivaMOS, a leader in high resolution dynamic X-ray detectors.

ASYMTEK Products | Nordson Electronics Solutions

IPC’s U.S. Skills Gap Study Reveals Skills and Qualifications in Short Supply

Industry News | 2017-04-27 17:50:10.0

In response to mounting concern about the shortage of U.S. workers with skills needed by electronics manufacturers, IPC – Association Connecting Electronics Industries® conducted a “fast-facts” study to learn more about the skills gap as it affects U.S. electronics assembly manufacturers. The results, published last week within Findings on the Skills Gap in U.S. Electronics Manufacturing, indicate that most companies are having a hard time recruiting qualified production workers, and an even harder time finding qualified engineers and other technical professionals.

Association Connecting Electronics Industries (IPC)

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