Industry Directory | Consultant / Service Provider / Manufacturer
ECM, Custom Cable & Wire Harnesses Assembly, PCB Assembly, SMT, Turnkey, Contract Manufacturing, Engineering, mold manufacturing, laser cutting. Volume discounts apply. Email your RFQ to dave@adnorthamerica.com.
Industry Directory | Manufacturer's Representative
Offer the best in class equipment & materials to our customers, both in performance as well as support. Work with companies in Oregon, Washington, Idaho, Montana, and the Province of British Columbia.
Century Circuits & Electronics manufactures flexible circuits with industry leading cycle times from prototype through production.
New Equipment | Industrial Automation
Moore Automation Limited Contact: Sandy Lin mailto:unity@mvme.cn Skype: live:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Product details: 1.All product pictures are real figure, please contact us if y
Electronics Forum | Mon Jan 22 12:24:36 EST 2007 | dave
thanks for reply. Problem sorted - Inverter for Bottom Blowers faulty. This did not give any error ! Dave.
Electronics Forum | Sat Jan 27 06:59:10 EST 2007 | dave
Hi, Why is no-clean and rf not considered to be a good process? Dave
Industry News | 2023-03-30 22:45:02.0
Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.
Industry News | 2019-12-17 14:33:13.0
December 17, 2019 – GPD Global has placed a MAX II precision dispenser at Universal's lab in New York (APL).
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Career Center | Toronto, Ontario Canada | Engineering,Management,Purchasing
Company Overview: Our client, part of a �Fortune 500� is a major Toronto-area, 500 employee (non-union) site manufacturing a wide range of electronics products for aerospace applications. Position Summary: The Site Director for the Toronto facility
Career Center | San Diego, Michigan USA | Sales/Marketing
* Results driven Sales Executive combining expertise in Building Sales networks and strategic business development in the Electronic Component, Connector, and Electronic Manufacturing Equipment industries * Extensive Field Sales experience with a tra
Career Center | Howell, Michigan USA | Sales/Marketing
Results driven sales executive combining expertise in building sales networks and strategic business development in the Electronic Component, Connector, and Electronic Manufacturing Equipment industries. Extensive field sales experience with a track
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/contact-us/united-states-sales-contacts/connecticut
: Dave Wilson Competitive Edge Solutions 54 Ash St Hopkinton MA 01748 508-497-5024 dave@cesolutionsllc.com In This Section Contact Us Worldwide Sales Offices United States Sales Contacts Alabama Alaska Arizona Arkansas California Colorado Connecticut Delaware Florida Georgia Hawaii Idaho Illinois Indiana
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