Electronics Forum | Thu Oct 22 22:01:33 EDT 2020 | SMTA-64386500
Hi John - send me an email (david.hillman@collins.com) and I can send you a few photos of what Mike K. was describing in terms of the solder joint surface being "etched" by the cleaning solution. The dull appearance is due to the abundance of lead o
Electronics Forum | Tue Mar 07 10:46:24 EST 2006 | muse95
I have to disagree with you, BillyD. If Craig searches the forum, he will see that the concept of a Pbfree BGA with SnPb paste has been debated many times. You say it is fine. I say it is NOT. There have been several studies done that clearly sho
Industry News | 2018-10-18 19:57:48.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
Industry News | 2023-02-13 15:22:16.0
Bob Cooke, Michael Ford, and Christina Rutherford take top honors
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
SMTnet Express, January 5, 2014, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Last Will And Testament of the BGA Void Dave Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, Ross Wilcoxon - Rockwell Collins
Labs, Dave Hillman - Rockwell Collins, Michael Ba
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
, Heather McCormick, Peter Read, Richard Popowich, and John Osenbach, “The Influence of Solder Void Location on BGA Thermal Fatigue Life,” Proceedings of SMTAI 2010, 132-140, Orlando, FL, October 2010. [16] David Hillman, Dave Adams, Tim Pearson, Brad
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