Electronics Forum | Mon Sep 19 07:34:14 EDT 2011 | henrytcx89
I would like to ask a few things about die crack. 1. I would like to know what could possibly be the root cause of die crack in die preparation? (Saw machine? Pick and Place machine?) 2. May I know how could I solve the problem? Thank you very muc
Electronics Forum | Mon Sep 19 09:25:29 EDT 2011 | tech1
There are a few questions I have before we can answer this: 1. How are the die presented to the pick and place machine? (Tape, waffle Pak, tray) 2. What are the dimensions of the die (LxWxH)? 3. Are they bumped die? 4. What is the material of the
Electronics Forum | Mon Aug 16 00:05:52 EDT 1999 | Will Grubb
Hello I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce whi
Electronics Forum | Sat Sep 24 16:06:13 EDT 2011 | tech1
Okay so you are picking from a Wafer Frame and it is a UV cured tape. Who's die sorting machine are you using? You mention the ejector needles, but have you checked them? What size are the die and how thick are they? Have you checked the UV cure, i
Electronics Forum | Mon Aug 16 04:38:18 EDT 1999 | Earl Moon
| Hello | I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce
Electronics Forum | Mon Sep 19 19:22:11 EDT 2011 | henrytcx89
Thanks for taking ur time to answer this. =) The pick and place machine is just pick from wafer(on tape) and place into waffle pack. I read from some of the sources saying that the ejecting needle and the vacuum pick up bits could cause the die to c
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