Industry News: de-bonding (2)

AI Technology, Inc (AIT) Introduces 3D-TSV Ultra-Thin Wafer Processing Temporary Bonding Adhesive Film

Industry News | 2015-03-20 09:51:33.0

THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION

AI Technology, Inc. (AIT)

Temporary Bonding Adhesive for Thin Wafer Handling

Industry News | 2016-08-17 09:26:56.0

AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.

AI Technology, Inc. (AIT)

Technical Library: de-bonding (2)

The Effect of Solder Mask And Surface Mount Adhesive Types on a PCB Manufacturing Process.

Technical Library | 1999-07-21 09:04:04.0

A high volume manufacturer of printed circuit boards (PCBs) had attempted for many years to locate an adhesive that was robust enough to meet their manufacturing needs. This proved to be a challenge because they needed the adhesive to accommodate a wide range of different dispensing equipment and board designs. The two key performance criteria required from the adhesive were dispensability and adhesion...

Henkel Electronic Materials

A Review of Corrosion and Environmental Effects on Electronics

Technical Library | 2013-08-01 13:17:44.0

Electronic industry uses a number of metallic materials in various forms. Also new materials and technology are introduced all the time for increased performance. In recent years, corrosion of electronic systems has been a significant issue. Multiplicity of materials used is one reason limiting the corrosion reliability. However, the reduced spacing between components on a printed circuit board (PCB) due to miniaturization of device is another factor that has made easy for interaction of components in corrosive environments. Presently the knowledge on corrosion issues of electronics is very limited. This paper reviews briefly the materials used in electronic systems, factors influencing corrosion, types of corrosion observed in electronics, and testing methods.

Technical University of Denmark

Partner Websites: de-bonding (507)


de-bonding searches for Companies, Equipment, Machines, Suppliers & Information

Sm t net
  1  
pcb precision cleaning

Easily dispense fine pitch components with ±25µm positioning accuracy.
SMT feeders

Best Reflow Oven
IPC Training & Certification - Blackfox

World's Best Reflow Oven Customizable for Unique Applications
one-stop for smt solution

ARE HUMIDITY INDICATORS PART OF YOUR SUPPLY NETWORK? Register for the webinar!