Seltek International Inc. is a company with 25+ years of experience in the manufacturing, representation and distribution market of heat shrinkable tubing machines, wave soldering machines, etc. With locations in Mexico and USA
About our company-ABB MODEL EL3020 Thanks for your time to visit our website. www.cambiaplc.com Cambia Automation Limited is a reliable supplier can offer you PLC DCS TSI products. We have thoughful service to help you expand your automation mark
Product display Product highlights Brand new and original in box--2-3 days against the payment --1 Year Warranty-- Full Tested -- Worldwide Shipping -- Good Service.. Emergency Shipping Click here to Contact us? Email: sales6@cambia.
Electronics Forum | Tue Oct 17 12:12:10 EDT 2017 | dustind19871
I know I have seen several old threads about this screen printer. I was curious if there was anyone out there that had any luck tracking anything down parts or info wise about these printers. I have one and I am trying to source the correct timing b
JUKI Mounter fx-1r parameters: Board size: 410*360mm Component height: 6mm 33,000CPH：chip (optimal) / 25,000CPH: chip (IPC 9850) Two independent multi-nozzle laser heads (8 total nozzles) from 0603 （0201） to 20mm square components or 26.5×
Industry News | 2013-07-24 16:08:44.0
Blakell Europlacer announces that it hosted the first user group meeting in May 2013 for customers of Smans, Europlacer’s pick-and-place distributor for the Benelux region.
Industry News | 2003-06-05 08:11:23.0
Kerry co-solvent system pays for itself in 13 months
Offer JUKI MOTOR T E93017210A0 L402-021EL0 for Surface Mount Technology 730 Specifications: 1.JUKI T MOTOR 2.PN: E93017210A0 3.Model: L402-021EL0 4.Ensure :Test in machine before shipping 5.Original 100% Sell & Buy Smt machine and spar
SMT Motor Original brand new JUKI740 730 Z Axis motor L404-151EL8 E93077210A0 Juki motor models: JUKI 750/760 ZT Axis Motor P50B03003PXS22 100V 30W E93077250A0 E93067250A0 JUKI 750/760 X Axis Motor TS4513N1820E200 200V 600W E9611721000 JUKI 750/
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
03006399-01 HOSE 6x4 Reject Placement Circuit 03006400-01 HOSE 8x5 Stop Circuit 03006405-01 DISTRIBUTOR APPLICATION HEAD COMPL. 03006411-02 CONTROL UNIT TAPE CUTTER HF 03006414-01 progr. FLASH CONTROL UNIT HF/X-Series 03006457-02 CALIBRATION UNI
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I am in the field of smt equipment for 15 years already and at present i am working as a Service Engineer for High Speed mounter machines . Our Company is solly Sales & Service providers of all pcb assembly and semiconductor equipment. I do inter
SMTnet Express, May 22, 2014, Subscribers: 22782, Members: Companies: 13894, Users: 36234 Pb-free solders: Comparison of different geometrical models in calculating of enthalpy of mixing of In-Sn-Zn ternary system. A. Boulouiz, M. El Moudane, M
principal Connect Productos y negocios Sustentabilidad Company Medios de comunicación Inversionistas Carreras Cerrar Inicio / Productos y soluciones / Productos / Polyglykol AM/20-20 Products Polyglykol AM/20-20 Polyglykol AM/20-20 is a random EO/PO-copolymer with allyl and methyl