Electronics Forum | Thu Oct 24 06:01:16 EDT 2002 | Kent
I'm currently dealing with an design of an end effector that need to pick n place a BGA dead bug package. The design is using peumatic system to do the task. Any advise or suggestion on this kind of design?
Electronics Forum | Wed Jun 09 02:35:10 EDT 2004 | Bernard
Base on the PORON foam rubber recommended, is it possible to apply on small BGA chip of 4x4 ball size 0.3mm. Any specific part no and supplier for this type of foam and is it a anti-static material? Would it be possible to punch out at dia. 3mm?
Career Center | vestal, New York USA | Quality Control
Over 7 years of experience as lead quality engineer in the filed of SMT. Extensive knowledge on Universal GSM,GC60 and GC120 Machines. worked on IBM Rational and Mercury Winruner testing tools.
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