6.6Mpa 4, Akron abrasion: 0.193cm3, Elongation:450% min 5, Rubber Compound blended with CN layer 6, Supplied in continuous rolls of up to 10m long or as customized 7, Easy to install with fewer joins, one product suits varying pulley face width
The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent
Electronics Forum | Wed Apr 26 01:48:07 EDT 2000 | Eric Chua
Hi Steve, What type of chemical used for washing stencil. Must be take note. Thanks.
Electronics Forum | Fri Apr 28 21:33:01 EDT 2000 | JP
I had a similar problem. We wold begin to notice the debonding within hours after recieving the stencils. As it turned out, our stencil vendor, located in CA, was shipping the stencil to our facility, located in ND, before the epoxy was fully cured
Industry News | 2015-03-20 09:51:33.0
THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION
Industry News | 2016-08-17 09:26:56.0
AI Technology, Inc. (AIT) manufactures a series of temporary bonding materials for processing temperatures up to 150 Cº. They are well accepted for grinding, dicing, etching, and deposition. AIT customers prefer AIT bonding materials over conventional wax materials specifically because AIT’s products feature ease of use and quick removal, especially for very delicate compound wafers and photonics.
