Automatic Glue Dispenser DMDJ331 Features ▶Humanized design, Chinese hand-held teaching box operation, convenient programming, easy to learn; ▶ It has the functions of drawing points, lines, surfaces, arcs and various irregular curves continuously a
Automatic Glue Dispenser DMDJ331 Features ▶Humanized design, Chinese hand-held teaching box operation, convenient programming, easy to learn; ▶ It has the functions of drawing points, lines, surfaces, arcs and various irregular curves continuously a
Electronics Forum | Tue Aug 09 10:02:07 EDT 2005 | davef
Td or Decomposition Temperature (the temperature that the epoxy actualy starts to break down) should be greater than 330*C for lead-free. Search the fine SMTnet Archives for more on Td.
Electronics Forum | Mon Dec 19 07:29:30 EST 2005 | jax
Tg is just a way to say when the board goes limp... or a quick way to rank laminates... who cares. For lead free you want to look at Td, Decomposition Temperatures. ( Temp at which the material weight changes by 5% )
Industry News | 2013-12-18 15:18:53.0
Isola Group had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products. The cost benefits of manufacturing in Asia have enabled a price reduction of I-Speed for printed circuit board (PCB) fabricators located in the Asia-Pacific region.
Technical Library | 2021-11-03 16:49:59.0
Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.
Article Return to Front Page A Low Temperature Alte
Imagineering, Inc. | https://www.pcbnet.com/blog/selecting-pcb-materials-for-fabrication/
. The decomposition temperature is the point at which a PCB substrate loses at least 5% of its mass. This damage is not reversible
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/fluxless-reflow-1.pdf
enters the process chamber with inert atmosphere Formic acid vapor is introduced into the process chamber Product is heated above the solder liquidous temperature Product is cooled and exits the tool
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