Contact us if the item you are urgent.Often we have large stack to meet you needs ! mailto:firstname.lastname@example.org Contact: Sandy Lin Email:email@example.com Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 . 6 Mo
Electronics Forum | Wed Mar 24 16:50:08 EST 2004 | davef
RA and RMA flux residues are "sealed" in a hard, glassy coating that do not require cleaning in many end-use environments. That being said, automotive, automotive underhood, and deep well are in that [ascending] order the three most burtal environme
Electronics Forum | Fri Aug 18 09:29:20 EDT 2006 | chrisgriffin
I would measure the voltage on the yellow wire going to the air pressure sensor. Are you getting 24VDC? If so, maybe replace the input DC module on IO card #2. I think it is IDC module 8 on that board. Try not to have too many violent thoughts.
8mm, 12mm, 16mm, 24mm, 32mm, 44mm IQ ( Intelligent ) Surface Mount Tape Feeders and tape feeder reel arms for QUAD Q series and C series pick and place machines. These are the newer 8 pin, deep pocket, feeders and they will work on the newer intellig
Agilent-Keysight DSO81304A Bandwidth: 13.0 GHz Channels: 4 12 GHz bandwidth, 13 GHz DSP enhanced bandwidth oscilloscope with up to 40 GSa/s sample rate Up to 2 Mpts MegaZoom deep memory at 40 GSa/s sample rates and 64 Mpts MegaZoom deep memory a
Industry News | 2015-06-11 13:48:32.0
Europlacer has appointed Dan Trinka and 4Tech Electronics as the newest on its growing list of premium manufacturer’ representatives. In addition to serving as an enhanced resource for Europlacer customers throughout Michigan and Ohio, 4Tech will support Europlacer’s growth trajectory while the company continues gaining market share because more assembly experts are choosing Europlacer pick-and-place equipment, SMD Component Storage Towers and fully integrated Stock Management software to optimize their production processes.
Industry News | 2019-10-16 14:45:19.0
MIRTEC announces that the company will premier its all-new ALPHA 3D Automated Optical Inspection System at productronica 2019. New to this event, Messe München and Konradin Verlag have organized a 3D AOI Arena in Hall A2. Leading 3D AOI manufacturers such as MIRTEC will demonstrate their latest 3D Inspection Technology at this four-day event scheduled to take place Nov. 12-15, 2019, at the Munich Trade Fair Center in Munich, Germany.
Reference to the high standards set Feeder jig calibration reference point, high standard strip fixture with adjustable object Independent functional software system can be realized on proofreading objects at different speeds forward and reverse ope
Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
Technical Library | 2006-11-01 22:37:23.0
Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment. One such test can be the Deep Thermal Cycle (DTC) environmental stress which cycles from -55°C to 125°C. This “hammer” test provides the customer with a level of security for robustness, but does not typically represent conditions which a module is likely to experience during normal handling and operation.
Beyond the hype, what hat does 'smart' technology do for the customer? Bjorn Dahle, CEO at KIC joins SCOOP's Philip Stoten to explore how value can be delivered and the importance of deep domain expertise to optimize processes and inform production b
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Tue Apr 25 07:00:00 EDT 2017 - Tue Apr 25 16:30:00 EDT 2017 | Rosemont, Illinois USA
Employment Law Forum 2017
SMTnet Express, January 22, 2015, Subscribers: 22,251, Members: Companies: 14,183, Users: 37,571 High Temperature Ceramic Capacitors for Deep Well Applications. R. Phillips, J. Bultitude, A. Gurav, K. Park, S. Murillo, P. Flores, M. Laps - KEMET
PANASONIC CM/NPM deep pocket (26mm) 24/32mm feeder N610133537AA QYSMT Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US My Cart Sign in Products PANASONIC CM/NPM deep pocket (26mm
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