A value-priced high-performance printing solution designed to meet the demands of high-volume production The Momentum® II 100 stencil printer is a hard-working, value-priced machine utilizing the robust, reliable Momentum series p
Siemens DEFLECTION UNIT X 00330938 Siemens DEFLECTION UNIT X 00330938 SMT Spare Parts Siemens Spare Parts Delivery time: 1-3 days Product description: Siemens DEFLECTION UNIT X 00330938 INQUIRY Siemens DEFLECTION UNIT X 00330938 Spe
Electronics Forum | Mon Jan 31 20:07:29 EST 2022 | emeto
Thank you both, it is not the good HLA design and this is why the deflection is needed to sit everything properly in the case. We did ask cust0mer(we are CM) to change it, I am just looking for a standard to support our claim.
Electronics Forum | Mon Jan 24 20:46:07 EST 2022 | emeto
Hello, we have a stiff board that goes to HLA, where some force is applied over the board to make it fit in. This force creates some deflection/bending of the PCBA and in result we see some functional failures. I wonder if there is any standard that
Industry News | 2010-09-20 19:36:19.0
Industry-leading associations IPC and SMTA jointly announce the agenda for Session 1 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Technical Library | 2021-09-15 18:58:01.0
Mathematical model for dynamic force analysis of printed circuit boards has been designed to calculate dynamic deformations and stresses in printed circuit boards and assess their dynamic strength and rigidity. The represented model describes a printed circuit board as a separate oscillatory system, which is simulated as prismatic beam set on two oscillating supports. Simulation and assessment of stress and deflection in printed circuit boards and obtaining their amplitude frequency responses provided recommendations, which ensure strength and stiffness of printed circuit boards subjected to dynamic loads..
Technical Library | 2021-06-15 18:40:53.0
The jet printing of a dense mixed non-Newtonian suspension is based on the rapid displacement of fluid through a nozzle, the forming of a droplet and eventually the break-off of the filament. The ability to model this process would facilitate the development of future jetting devices. The purpose of this study is to propose a novel simulation framework and to show that it captures the main effects such as droplet shape, volume and speed. In the framework, the time dependent flow and the fluid-structure interaction between the suspension, the moving piston and the deflection of the jetting head is simulated. The system is modelled as a two phase system with the surrounding air being one phase and the dense suspension the other. Hence, the non-Newtonian suspension is modelled as a mixed single phase with properties determined from material testing. The simulations were performed with two coupled in-house solvers developed at Fraunhofer-Chalmers Centre; IBOFlow, a multiphase flow solver and LaStFEM, a large strain FEM solver. Jetting behaviour was shown to be affected not only by piston motion and fluid rheology, but also by the energy loss in the jetting head. The simulation results were compared to experimental data obtained from an industrial jetting head.
Fraunhofer-Chalmers Research Centre for Industustrial Mathematics
00365776-01 Limit Switch Width Adjustment 2 00365777-01 Limit Switch Mounting Tub 00366104-01 TR-GREASE NIPPLE 00366174-01 CARTOUCHE FOR GREASE 00366229-01 RETROFIT KIT CAL.. f. S25HM2/HS55/HF 00366391-01 STOPPER PCB ADJUSTMENT 00366392-01 Sto
00359433-01 Reflection Light Barrier, configured 00359434-01 Crash Light Barrier,configured 00359435-01 Neutral Position Light Barrier 00359436-01 Unlock Device WTC 00359438-01 Connection Cable: Power MTC 00359459-01 LIFTING TABLE SINGLE CONVEYO
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/1116.html
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/overhanging-die-shear
. Performing ball bond shear testing can be difficult due to the thin spacing between die and low profile wire bonding and the possible deflection of the surface during load tool landing and setting
