Industry News | 2010-04-22 16:26:45.0
DEK's ProFlow® system is arguably the gold-standard for enclosed head printing technology. With nearly a decade of documented process advance under its belt, ProFlow has now evolved to deliver even greater electronics assembly performance, ease-of-use and environmental responsibility with ProFlow ATx.
Industry News | 2008-03-20 21:02:07.0
Since it�s introduction to the electronics industry over ten years ago, DEK�s ProFlow� enclosed head printing system has won numerous awards and effectively enabled many advances in materials deposition applications around the globe. Now, as ProFlow moves into its second decade, the technology has been further developed to deliver an expanded process window and even broader capabilities.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
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