Technical Library | 2013-11-21 12:01:11.0
Previous experimentation on a highly miniaturized and densely populated SMT assembly revealed the optimum stencil alloy and flux-repellent coating for its stencil printing process. Production implementation of the materials that were identified in the study resulted in approximately 5% print yield improvement across all assemblies throughout the operation, validating the results of the initial tests. A new set of studies was launched to focus on the materials themselves, with the purpose of optimizing their performance on the assembly line (...) Results of the prior tests are reviewed, and the new test vehicle, experimental setup and results are presented and discussed.
Technical Library | 2011-12-08 17:46:42.0
The past few years have brought PCB assemblers a multitude of choices for SMT stencil materials and coatings. In addition to the traditional laser-cut stainless steel (SS) or electroformed nickel, choices now include SS that has been optimized for laser c