Manufacturer of Semi-Auto SMT Printers,Suppliers for USC rolls(all type of printers-Dek,MPM and others).Dek Spare Parts,Manufacturer of Temp. and Humidity Control Systems,Repair House,,Manufacturer of Squeegees(all type)New Design Universal Squeegee Holder(can be used on all make SMT Printers)
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Electronics Forum | Tue Nov 20 18:56:19 EST 2018 | dekhead
If always on... you will need to write product file as edge justified, and position stencil properly before auto-clamping takes place. If always off... you will need to write product file as center justified... and position stencil and acknowledge st
Electronics Forum | Wed Nov 21 00:14:25 EST 2018 | leeg
As Dekhead has said, sounds to me like you have the wrong setting in your screen choice within the program, is it edge or centre justified?
2003 DEK Horizon 01 Screen Printer *** Note: This lot contains two items. (1) DEK Horizon 01 Screen Printer (1) DEK VF35 Vacuum System Approx Dimensions: 70" x 70" x 68" Location: Jasper, IN USA Serial: 281505 Features: o Advantec 2.05 Computer syste
Industry News | 2011-02-15 19:26:42.0
Europlacer debuts the iineo-II VLB. The dual-head iineo-II VLB is the latest enhancement to the Europlacer product portfolio, designed for the growing LED assembly segment.
Industry News | 2011-05-16 15:29:22.0
Europlacer announces that it has been awarded a 2011 EM Asia Innovation Award in the category of Pick-and-Place Systems/Equipment (Low/Medium Volume) for its iineo–II VLB.
YAMAHA YV100x KV7-M9237-00X CYLINDER PBSA10*5 Edge clamp CYLINDER
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
ITW EAE is announcing new features for the MPM® Edison™ Printer. Board staging, designed to meet the demands from Automotive manufacturers for reduced cycle time, will now be a feature on the Edison. And the new EdgeLoc™ II is a robus
Career Center | Ballston Spa, New York USA | Engineering,Maintenance,Production,Purchasing,Quality Control,Research and Development,Sales/Marketing,Technical Support
Qualifications / Skills: Maintain and repair X-Ray inspection equipment Maintain Surface Mount Manufacturing Systems Full DEK OEM equipment training Train Surface Mount Technology, Semiconductor, and Solar Photovoltaic operators and engineers Mainta
Effect Of Board Clamping System On Solder Paste Print Quality Effect Of Board Clamping System On Solder Paste Print Quality Stencil printing technology has come a long way since the early 80s when SMT process gained importance in the electronics
^LIP SEAL DEK 183961 CYLINDER 4 STROKE 20 BORE ( TXT ) DEK 165675 BOM^^BOARDSTOP KIT^LIP SEAL DEK 193377 MODIFIED CYLINDER (FROM 107460) DEK 107850 ASSY^BOARD CLAMPS^QUICK RELEASE^250 MM ( TXT ) DEK 178031 FOIL /SHIM, 520 MM QF B/CLAMP
20 BORE 165675 DEK BOM BOARDSTOP KIT LIP SEAL 193377 DEK MODIFIED CYLINDER (FROM 107460) 107850 DEK ASSY BOARD CLAMPS QUICK RELEASE 250MM 178031 Packaging