Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1
Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di
Electronics Forum | Wed May 20 17:18:09 EDT 2009 | daxman
Just out of curiosity, how are you or anyone else determining a defect? Last I checked, IPC had no criteria yet for solder defects for QFN components. Has this changed? Biggest problems we see are voids which our x-ray shows a lot of. Our problems
Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist
I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i
Electronics Forum | Thu Mar 03 09:04:26 EST 2005 | russ
Been following this thread and have a question, Why do "touch-up" people follow different criteria than "Q.C." people. It sounds like the root of the problem is not addressed but bandaids are being put into place. We have no "Q.C." department and
Electronics Forum | Wed Sep 15 11:08:45 EDT 1999 | Dave F
| I am looking for help on doing smt equipment qualifications. I need to find some examples to follow. The equipment to be qualified is a Stencil Machine, Pick and place machine, and Reflow oven. We manufacture medical devices so it has to be somewha
Electronics Forum | Thu Jun 15 18:15:34 EDT 2006 | nickel
If you have time, download the free Practical Guide to Understanding the Scope of the WEEE and RoHS, you will find what they say about UPS. They consider UPS out from the field of application of RoHS. ORGALIME (Bruxelles)is the European Engineering
Electronics Forum | Tue Jan 31 13:41:12 EST 2006 | outgasser
We are currently experiencing problems with delamination during rework/2nd op activity on lead free. I am suspecting this is a result of the use of a heat gun to rework components. My assumption is that the high heat and time in area greatly increa
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Wed Nov 03 09:42:31 EST 2004 | dramos1
Hi Simon, Thanks for the immediate reply. We really appreciate it very much. Currently, we are using Class 2 for the visual inspection criteria of our telecom boards. In IPC-A-610 Rev. C criteria, there are TARGET, ACCEPTABLE and REJECT criterias.
Electronics Forum | Thu Mar 10 12:19:17 EST 2005 | rlackey
Borrow a large hungry dog (or wolf if local wildlife permits) & chain it up in the corner of the office when the salesman comes in. Then look over at it repeatedly whilst talking about your requirements. Feel free to leave him alone for a while...
