3D X-ray Offline CT Inspection System For Semicon/Electronics Inspection--ML-MirXT-160 Equipment overview The 3D X-ray inspection system ML-MirXT-160 is specially tailored for wafer technology, SMT, packaging inspection, semiconductor and laborator
New Equipment | Cleaning Equipment
Automatic SMT Stencil Cleaning Machine BMP-1000X Feature ▶The cleaning tank, the original tank, and the spray tank are designed with a liquid level sensor overflow alarm. ▶The opening of the front door is designed with photoelectric sensor protectio
New Equipment | Cleaning Equipment
Fully Automatic SMT Stencil Cleaning System BMP-700S Feature ▶The cleaning tank, the original tank, and the spray tank are designed with liquid level sensor overflow alarm. ▶The opening of the front door is designed with photoelectric sensor protect
New Equipment | Cleaning Equipment
Fully Automatic SMT Stencil Cleaning System BMP-700S Feature ▶The cleaning tank, the original tank, and the spray tank are designed with liquid level sensor overflow alarm. ▶The opening of the front door is designed with photoelectric sensor protect
Splice Pocket for Splice Clip & Splice Tapes / “New” To connect both ends of cover tape of Paper or Emboss carrier tape * Stock of Stapler Splice Clip & Splice Tape * Easy to attach & detach by Magnetic type * Easily detachable sticker type from poc
The new routing machines of the SAR-CL-series offer the user a largely automated, nearly stress-free and cost effective detachment process to replace traditional detachment methods, such as circular plate, side cutter or punch unit. These routers ca
The PARROT PCS Clip , due to its new metal tip has 8 advantages: 1) High insulation - 1000V 2) Good accessibility, can be used in small, narrow places 3) Positive, low point contact resistance approximately 3 mohm (metal tip with sharp edges) 4)
Compact Premium Modular Mounter Compact Premium Modular Mounters SIGMA-G4 and SIGMA-G5 achieve high productivity and high quality with functions such as direct drive head, overdrive motion detection apparatus, and linear motor driven XY beams. SIGM
The Fritsch Convection Reflow Soldering System uses recirculated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat
1. Usage : To connect cover tape of Paper or Emboss Carrier Tape. 2. Feature : Consumables of easily detachable sticker type. Superpowerful adhesiveness (two or three times stronger than existing product). When it can be used by our splice device
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