Electronics Forum | Thu Jan 29 16:10:09 EST 2004 | blnorman
Another equipment manufacturer is Smart Sonic. Most equipment manufacturers have their own chemistries, but they are also willing to use other cleaners. What we have done is to send boards that need to be cleaned to the equipment manufacturer. W
Electronics Forum | Wed Feb 04 13:12:35 EST 2004 | Debbie
Hi Rick, Cleaning No Cleans is becoming more of a norm. It is true that changing to a OA flux/paste would be a easier process to control from a cleaning standpoint. A water soluble process will cost a great deal less as well. However, if your pro
Electronics Forum | Fri Jul 13 00:11:41 EDT 2001 | qinongzhu
We are preparing a batch of samples for test. several IC which packaged by BGA/CSP was removed from PCB by reworkstation. However, I need to re-use this IC. I want to know whether there is a way to remove the solder balls from these IC devices and ca
Electronics Forum | Sun Feb 01 18:24:52 EST 2004 | Dean
Ok, maybe I'm missing something here: It's a no clean flux type AND your going to wash it? Why not migrate to OA Flux and just run DI water with Ion-Exchange beds? Benefits: No need for ultrasonics No need for chemical isolation No need for cleani
Electronics Forum | Mon Apr 26 12:51:45 EDT 1999 | Bob
Steve, Moisture sensitivity needs to be taken seriously. Being in the commercial end of electronics now, I am using many plastic packages. Unfortunately, moisture sensitivity processing is not black and white and it does require procedures and dis
Electronics Forum | Mon Aug 16 00:05:52 EDT 1999 | Will Grubb
Hello I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce whi
Electronics Forum | Wed Dec 22 10:18:52 EST 2004 | tonyfox
Our company laser re-ball's BGA down to 100 microns ball size. One of our OEM customers have asked us to function test there BGA on Mobile phone PCB's. Origionally we thought of a test sockets however the sockets interfere with other devices on the P
Electronics Forum | Wed Jul 27 17:53:25 EDT 2005 | GS
Is your Moisture Sensitive Device handling process correct ? Some time internal delaminations beave like the pbm you have. Regards... GS
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Mon Aug 16 04:38:18 EDT 1999 | Earl Moon
| Hello | I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce
