Electronics Forum | Fri Mar 06 10:46:35 EST 2009 | davef
First, we agree with Loco that your QFP is nonwetting, rather than dewetting. Your sceen-shots look like ol' timey SnPb paste recipes. Turn-up the heaterometer dial. Second, on nitrogen: * We kinda think your O2 needs to be around 100ppm with 99.99%
Electronics Forum | Tue May 31 10:58:31 EDT 2005 | davef
There are a host of possibilities. Virtually any fabrication process prior to outer layer manufacturing prior to HAL could contribute to dewetting. That goes all the way to excessive brighteners in the copper plating line. Anything that prevents the
Electronics Forum | Thu Jul 30 13:52:34 EDT 2009 | davef
Thoughts are: * 215-220 temperature at the leads is not real hot for leaded assembly. * It's peculiar for component leads to dewet. Sometimes non-wetting occurs along the edge of the lead where the lead is not plated. * How do the leads of a removed
Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com
USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R
Electronics Forum | Thu Oct 27 08:27:57 EDT 2005 | Adam
Hi We are trying to solder a a contact whose base material is stainless steel, this is then nickel striked with a gold plating of upto 3 microns. We are trying to hand solder this to a standard 1.6 FR4 PCB with a HASL finish. We are seeing problems
Electronics Forum | Thu Aug 28 21:43:23 EDT 2008 | davef
Couple of points: * We'll tell ya, although it's tough to tell from these pix, but it does not look like dewetting. It looks like nonwetting. * We don't think you're getting this product hot enough. We don't know where you measured the profile you po
Electronics Forum | Tue Aug 17 13:32:13 EDT 1999 | Brian
| Can anyone help on the subject of de-wetting during the spray coating process. We use PC29M Parts A+B spray coating material, Humiseal tapes and masking dots, Marigold supertouch V70N gloves and Concoat CM533 liquid masking material. We also use a
Electronics Forum | Mon Oct 12 15:51:47 EDT 2015 | davef
IPC-A-610E-2010, Acceptability of Electronic Assemblies, 8.3.4 Castellated Terminations talks to the acceptability of solder connections on components like yours. It’s tough to say from the pictures, but I’d say your issues are: Missing solder: Plat
Electronics Forum | Thu Nov 01 12:13:10 EST 2001 | jonathan
I guess this clarifies the defect more then looks at the process, but I�ll just through it out there for the sake of learning something new. If anyone would comment on this please feel free�. There are many different varieties of dewetting defects.
Electronics Forum | Thu Aug 19 19:04:55 EDT 1999 | Brian Wycoff
| | Can anyone help on the subject of de-wetting during the spray coating process. We use PC29M Parts A+B spray coating material, Humiseal tapes and masking dots, Marigold supertouch V70N gloves and Concoat CM533 liquid masking material. We also use
